Documents Include FPD Safety Guidelines, Substrate Handling Method
SAN JOSE, Calif., Feb. 11 /PRNewswire/ -- SEMI has published eight new
technical standards applicable to the semiconductor, flat panel display
(FPD) and MEMS manufacturing industries. The new standards, developed by
technical experts from equipment and materials suppliers, device
manufacturers and other companies participating in the SEMI International
Standards Program, are available for purchase in CD-ROM format or can be
downloaded from the SEMI website, http://www.semi.org.
SEMI Standards are published three times a year. The new standards,
part of the March 2008 publication cycle, join more than 770 standards that
have been published by SEMI during the past 34 years.
"These SEMI Standards represent new ground the volunteers in the SEMI
International Standards Program have broken over the years, including two
new standards applicable to FPD manufacturing," said Bettina Weiss, SEMI
director of International Standards. "As the FPD industry grows and
technical requirements are defined earlier and in concert with suppliers
and panel makers, these new specifications provide critical solutions to
manufacturing challenges."
The standards released today include a test method for determining the
leak integrity of gas delivery systems, a guide for design and materials
for interfacing MEMS microfluidic systems, and environmental, health and
safety (EHS) guidelines for FPD manufacturing.
The full list of SEMI Standards released today include:
SEMI C64
SEMI Statistical Guidelines For Ship To Control
SEMI C65
Guideline for Trimethylsilane (3MS), 99.995% Quality
SEMI C66
Guidelines for Trimethylaluminium (TMAl), 99.5% Quality
SEMI D51
Specification for Handshake Method of Single Substrate for Handing Off/On
Tool in FPD Production
SEMI F106
Test Method for Determination of Leak Integrity of Gas Delivery Systems by
Helium Leak Detector
SEMI M72 (Preliminary)
Test Method for Determining Wafer Flatness Using the Moving Average
Qualification Metric Based on Scanning Lithography
SEMI MS6
Guide for Design and Materials for Interfacing Microfluidic Systems
SEMI S26
Environmental, Health, and Safety Guideline for FPD Manufacturing System
The SEMI Standards Program, established in 1973, covers all aspects of
semiconductor process equipment and materials, from wafer manufacturing to
test, assembly and packaging, in addition to the manufacture of flat panel
displays, photovoltaic systems and micro-electromechanical systems (MEMS).
About 1,650 volunteers worldwide participate in the program, which is made
up of 18 global technical committees. Visit http://www.semi.org/standards
for further details about SEMI Standards.
About SEMI
SEMI is the global industry association serving the manufacturing
supply chains for the microelectronic, display and photovoltaic industries.
SEMI member companies are the engine of the future, enabling smarter,
faster and more economical products that improve our lives. Since 1970,
SEMI has been committed to helping members grow more profitably, create new
markets and meet common industry challenges. SEMI maintains offices in
Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai,
Singapore, Tokyo, and Washington, D.C. For more information, visit
http://www.semi.org.
/NOTE TO EDITORS: Following is more detailed information about the new
SEMI standards/
SEMI C64
SEMI Statistical Guidelines For Ship To Control
The SEMI C64 standard provides a consistent and robust statistical
methodology for calculating and maintaining ship-to-control limits. The
standard applies to incoming process chemical and material quality elements
of the manufacturing process.
SEMI C64 will provide a number of cost savings and economic benefits.
For example, providing such a material grade exerts pressure on suppliers
to both maintain and improve their process control and quality. Better
control of raw materials will provide improved control and capability to
optimize IDM production processes. IDMs will be able to directly compare
supplier capability using a common metric that is based on all relevant
supplier process data.
A standardized definition also allows suppliers to define a
ship-to-control grade of product that is not unique for each IDM customer.
Suppliers and IDMs will obtain the same control limits when this standard's
methodology is applied; reducing the need for further discussion of
statistics.
The statistical rule set of SEMI C64 integrates with existing
specifications and does not allow ship-to-control product to exceed already
existing specifications. The embedded statistical methodologies and tests
also have potential additional value in that they can provide better
control limits for trace contamination data than those obtained from
statistical methodologies currently in common usage.
SEMI C65
Guideline for Trimethylsilane (3MS), 99.995% Quality
Trimethylsilane is a silicon source which can be used for the formation
of interlayer dielectric (ILD) and diffusion barrier films for
semiconductor devices.
Over the past five to 10 years, in certain areas of memory and logic
devices, silicon has started to be replaced by new functional materials.
For example, the latest 45nm Intel processor incorporates a hafnium oxide
based material for the gate and a metal electrode. As the device industry
moves forward and begins to use even more new materials it will be
important to have guidelines and standards for chemical precursors that
generate these new materials.
For both chemical precursors, SEMI C65 will provide appropriate metal
and general contamination information. This information will assist end
users in determining what contaminates and at what level these contaminants
are important when setting up the deposition process. Additionally, the
guideline will assist chemical manufacturers in producing precursors
applicable to the various deposition processes.
For both sources, especially TMAl, many different grades and qualities
of product are available. While some of the many different grades are
application based and therefore unavoidable, for the same application the
same grade of material should be applicable. If all end users can use a
single grade of material for a specific process, then cost reductions could
be possible because chemical manufactures would not need to produce several
different grades of the same chemical for the same process.
SEMI C66
Guidelines for Trimethylaluminium (TMAl), 99.5% Quality
Trimethylaluminium (TMA1) has a number of applications in the
electronics industry, including deposition of epitaxial films for AlGaAs,
AlGaN and InAlGaP by metal organic chemical vapour deposition (MOCVD).
These layers find applications in products such as high brightness LEDs and
lasers.
More recently TMAl has been used extensively by all the major memory
manufacturers for atomic layer deposition (ALD) of aluminium oxide, which
is the dielectric layer of choice in DRAM devices.
For both chemical precursors, the SEMI C66 guidelines give appropriate
metal and general contamination information. This information will assist
end users in determining the source of contamination and at what level
these contaminants are important when setting up their deposition process.
Additionally, the guideline will assist the chemical manufacturer in
producing precursors applicable to the various deposition processes.
SEMI D51
Specification for Handshake Method of Single Substrate for Handing
Off/On
Tool in FPD Production
The purpose of SEMI D51 is to standardize the handshake methods for
transferring large size single substrates between process equipment and
transfer systems at FPD fabs.
Since each FPD fab uses different handshake specifications for single
substrate transfer, suppliers have to change handshake methods depending on
each fab. To solve these issues, it is important to define handshake
methods for transferring single substrates to the process equipment.
It is expected that FPD fabs will increasingly apply single substrate
transfer for large size substrates and a handshake for single substrate
transfer will be utilized in many cases. It is expected that the
implementation of this standard will result in improved efficiency in the
design, production and installation of equipment, as well as in cost
reduction. Using this standard will also improve efficiency in operation
and delivery, and realize early startup of the fab.
SEMI F106
Test Method for Determination of Leak Integrity of Gas Delivery Systems
by
Helium Leak Detector
Gas panels using surface mount components are entering the market as a
new gas distribution system technology. However, no test method is
available to evaluate both conventional and surface mount types of gas
systems. Consequently, test method standards commonly used by suppliers and
users are needed, as well as test method standards for the new sealing
technologies used for surface mounting.
The SEMI F106 standard covers both conventional metal face sealing and
surface mount gas delivery systems. The test method applies to all types of
high purity gas delivery system used in semiconductor manufacturing
facilities and comparable R&D areas.
The purpose of SEMI F106 is to define a test method to determine the
leak integrity of conventional and surface mount gas delivery systems. In
general, there are two types of test methods. One is the "inboard leak
test" and the other is the "outboard leak test." However, as far as SEMI
F106 is concerned, only inboard leak testing is employed because it is
practical for actual testing of gas delivery systems. This test method
defines two ways to determine the leak integrity. One is to determine the
leak integrity from one seal portion at one time and the other is to
determine the leak integrity from the entire gas system at one time by
using the hood method. Both ways use inboard leak testing.
SEMI M72 (Preliminary)
Test Method for Determining Wafer Flatness Using the Moving Average
Qualification Metric Based on Scanning Lithography
The SEMI M72 standard provides a metric for wafer flatness
specification that is consistent with scanning lithography focus control
and is applicable to both back and front surface referenced measurements.
This test method quantifies the flatness of wafers used in semiconductor
device processing in the polished, epitaxial, SOI, or other layer condition
through the use of the moving average (MA) as the measurement parameter.
It is also suitable for determining wafer flatness in the near edge
region of the wafer. Wafer flatness significantly affects the focus control
of lithography equipment and thereby the yield of semiconductor device
processing. Knowledge of this characteristic can help both suppliers and
users of silicon wafers determine if the dimensional characteristics of a
wafer satisfy given geometrical requirements. The test method was developed
for 200 and 300 mm diameter wafers having dimensions in accordance with
wafer categories 1.9.1, 1.9.2, 1.10.1, 1.10.2, and 1.15 of SEMI M1. It can
also be applied to other diameter wafers.
SEMI MS6
Guide for Design and Materials for Interfacing Microfluidic Systems
The SEMI MS6 standard provides a guide for design and materials for
interfacing MEMS microfluidic systems. It provides guidelines for general
fluidic interface design and materials selection that can reduce redundant
engineering efforts and lead to improved design, manufacturability and
operation.
SEMI MS6 provides value to the semiconductor manufacturing industry by
providing a general resource for assisting in early design and material
selection boundary conditions. This can result in shorter time to market
products where microfluidics are used.
SEMI S26
Environmental, Health, and Safety Guideline for FPD Manufacturing
System
Up to now, the display industry has had no formal EHS guidelines for
FPD manufacturing systems despite the increased risk from rapid generation
changes of substrate sizes. In the semiconductor manufacturing industry,
the existing SEMI S2 document is already widely used. However, the
semiconductor and FPD industries are different in terms of equipment
concepts. Therefore, it is difficult to apply the same safety guidelines to
both industries.
SEMI S26 has been developed specifically for the environment, health,
and safety of FPD manufacturing systems, describing the minimum design
guidelines related to EHS. This document also includes the criteria for
important safety issues in FPD manufacturing.
By adopting these criteria in the equipment specifications, it is
possible to standardize safety designs and reduce FPD manufacturing system
cost and development time. By conducting the appropriate risk assessment in
the design phase, safety measures offering good cost performance can be
introduced, resulting in system cost saving.
SOURCE SEMI
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Related links:
http://www.semi.org
CONTACT:
Bettina Weiss, +1-408-943-6998,
bweiss@semi.org or Scott Smith, +1-408-943-7957, smith@semi.org.,
both of SEMI
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