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North American Semiconductor Equipment Industry Posts January 2007 Book-to-Bill Ratio of 1.06

    SAN JOSE, Calif., Feb. 15 /PRNewswire/ -- North American-based
manufacturers of semiconductor equipment posted $1.71 billion in orders in
January 2007 (three-month average basis) and a book-to-bill ratio of 1.06
according to the January 2007 Book-to-Bill Report published today by SEMI.
A book-to-bill of 1.06 means that $106 worth of orders were received for
every $100 of product billed for the month.
    The three-month average of worldwide bookings in January 2007 was $1.71
billion. The bookings figure is about 14 percent higher than the final
December 2006 level of $1.50 billion and about 39 percent above the $1.23
billion in orders posted in January 2006.
    The three-month average of worldwide billings in January 2007 was $1.62
billion. The billings figure is about nine percent higher than the final
December 2006 level of $1.48 billion and over 28 percent higher than the
January 2006 billings level of $1.26 billion.
    "Bookings and billings for semiconductor manufacturing equipment from
North American-based companies increased as global memory chip makers
sustained investments in the period," said Stanley T. Myers, president and
CEO of SEMI.
    The SEMI book-to-bill is a ratio of three-month moving averages of
worldwide bookings and billings for North American-based semiconductor
equipment manufacturers.  Billings and bookings figures are in millions of
U.S. dollars.



                            Billings            Bookings
                       (Three-month avg.)   (Three-month avg.)   Book-to-Bill
    August 2006               1,742.8             1,729.7             0.99
    September 2006            1,672.8             1,639.2             0.98
    October 2006              1,562.9             1,468.6             0.94
    November 2006             1,486.1             1,426.5             0.96
    December 2006  (final)    1,482.3             1,497.2             1.01
    January 2007 (prelim.)    1,617.2             1,708.2             1.06
    The data contained in this release was compiled by David Powell, Inc.,
an independent financial services firm, without audit, from data submitted
directly by the participants. SEMI and David Powell, Inc. assume no
responsibility for the accuracy of the underlying data.
    The data are contained in a monthly Book-to-Bill Report published by
SEMI. The report tracks billings and bookings worldwide of North American-
headquartered manufacturers of equipment used to manufacture semiconductor
devices, not billings and bookings of the chips themselves.
    SEMI is a global industry association serving companies that provide
equipment, materials and services used to manufacture semiconductors,
displays, nano-scaled structures, micro-electromechanical systems (MEMS)
and related technologies. SEMI maintains offices in Austin, Beijing,
Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore,
Tokyo and Washington, D.C. For more information, visit http://www.semi.org.
    Editors Note:
    The February 2007 SEMI Book-to-Bill Report is scheduled for publication
on March 15, 2007; 3:00 p.m. PDT (subject to change).
    Independently from SEMI, The Semiconductor Equipment Association of
Japan (SEAJ) releases its October Book-to-Bill Report on approximately the
same date. The SEAJ Book-to-Bill Report tracks billings and bookings
worldwide of Japanese-headquartered semiconductor equipment manufacturers.
For more information on the SEAJ data, visit http://www.seaj.or.jp


SOURCE SEMI




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Related links:
  • http://www.seaj.or.jp
  • http://www.semi.org
    CONTACT:
    Dan Tracy, +1-408-943-7987, dtracy@semi.org,
    or Scott Smith, +1-408-943-7957, ssmith@semi.org, both of SEMI