Bluetooth(TM) and Wi-Fi(TM) Products Comprise Company's Offering of Chips
And Systems for End-to-End Wireless and Mobile Connectivity
CANNES, France, 3GSM World Congress, Feb. 19 /PRNewswire-FirstCall/ --
Broadcom Corporation (Nasdaq: BRCM), the leading provider of integrated
circuits enabling broadband communications, will demonstrate its new products
for wireless communications at the 3GSM World Congress in Cannes, France,
February 19 -22, 2002. Demonstrations include the company's recently announced
chips for wireless local area networking (WLAN) based on the 802.11b
(Wi-Fi(TM)) standard, as well as chips and systems for Bluetooth(TM)
applications.
As mobile phone technologies such as GSM (Global Standard for Mobile
Communications) evolve to provide advanced, high speed data services,
short-range wireless technologies become increasingly useful for distributing
this data among mobile phones, notebooks and handheld computers. Broadcom's
families of chipsets for short-range wireless communications leverage the
company's extensive experience in broadband communications and RF design in
standard CMOS technology, and have been designed to complement mobile
communications and computing platforms.
"The rapid evolution of network technology and applications in the last
decade revealed the benefits of effectively connecting intelligent multimedia
devices. Broadcom is applying this lesson to the mobile device market," said
Dr. Henry T. Nicholas III, President and CEO of Broadcom. "We've developed our
industry-leading Bluetooth and 802.11b Wireless LAN products with
consideration of how these short-range wireless technologies will best address
the evolving mobile data market. Our demos at the 3GSM World Congress
highlight our considerable capabilities in these areas."
"As an established supplier of chips for several different broadband
communications markets, such as cable and Ethernet, Broadcom is now quickly
establishing itself as a provider of high-performance solutions in the
wireless space," said Jeff Thermond, Vice President and General Manager of
Broadcom's Home Networking Business Unit. "Our products are built to provide
excellent radio performance in noisy environments such as the mobile phone.
Additionally, their low power consumption and low CPU utilization make them
ideal for battery powered portable devices."
At the Congress, Broadcom will show its products for Bluetooth and 802.11b
WLAN. The unique architecture of Broadcom's chips allows cellular handset
providers the ability to add personal and local area connectivity to
complement the new 2.5G and 3G wide area services being deployed by cellular
carriers today. Broadcom's demonstration will feature a recently announced
Bluetooth headset reference design with outstanding audio quality and talk
times. This headset is a natural compliment to Bluetooth-enabled handsets.
Broadcom will show its Blutonium(TM) line of Bluetooth devices. Bluetooth
is a cable-replacement technology for wireless data applications with lower
power, size and bandwidth requirements than WLAN. The standard was designed to
enable wireless short-range sharing of digital information at around one
Megabit per second (Mbps). The family of products includes the Broadcom(R)
BCM2033, a fully integrated Bluetooth systems solution incorporating radio and
baseband functions onto a single device, the BCM2002, a radio-only device that
can be used in applications where the Bluetooth baseband already exists in the
host device, and the BCM2013, a full, single chip Bluetooth wireless headset
solution providing unparalleled audio performance for hands-free connections
to mobile phones.
Broadcom's new Wi-Fi WLAN integrated circuits provide up to 11 Mbps of
connectivity and are designed for enterprise, small business, home, and public
access applications. The Broadcom BCM2051 2.4GHz direct-conversion radio and
the BCM430x family of baseband processors contain a number of industry-first
innovations. These silicon solutions are the first IEEE 802.11b-compliant
chipsets to be implemented in a standard digital CMOS process, which
represents the lowest possible silicon cost approach to wireless radio and
will enable new product price points via chipset integration as well as a
smaller solution footprint, which is important for portable devices. The
chipsets also provide the many advantages of a direct-conversion radio
architecture, superior performance in hostile multi-path signal environments,
and built-in hardware support for current and forthcoming enhanced wireless
encryption standards.
Arrangements to view Broadcom's demonstrations can be made at Booth #J36
in Hall 3 at the 3GSM World Congress in Cannes.
About Broadcom
Broadcom Corporation is the leading provider of highly integrated silicon
solutions that enable broadband communications and networking of voice, video
and data services. Using proprietary technologies and advanced design
methodologies, Broadcom designs, develops and supplies complete
system-on-a-chip solutions and related applications for digital cable set-top
boxes and cable modems, high-speed local, metropolitan and wide area and
optical networks, home networking, Voice over Internet Protocol (VoIP),
carrier access, residential broadband gateways, direct broadcast satellite and
terrestrial digital broadcast, digital subscriber lines (xDSL), wireless
communications, SystemI/O(TM) server solutions and network processing.
Broadcom is headquartered in Irvine, Calif., and may be contacted at
949-450-8700 or at http://www.broadcom.com.
Safe Harbor Statement under the Private Securities Litigation Reform Act
of 1995:
This release may contain forward-looking statements based on our current
expectations, estimates and projections about our industry, management's
beliefs and certain assumptions made by us. Words such as "anticipates,"
"expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will"
and variations of these words or similar expressions are intended to identify
forward-looking statements. In addition, any statements that refer to
expectations, projections or other characterizations of future events or
circumstances, including any underlying assumptions, are forward-looking
statements. These statements speak only as of the date hereof, and are based
upon the information available to us at this time. Such information is subject
to change, and we will not necessarily inform you of such changes. These
statements are not guarantees of future performance and are subject to risks,
uncertainties and assumptions that are difficult to predict. Therefore, our
actual results could differ materially and adversely from those expressed in
any forward-looking statements as a result of various factors.
Important factors that may cause such a difference for Broadcom in
connection with the BCM2033, BCM2002, BCM2013, BCM2051 and BCM430x products
include, but are not limited to, general economic and political conditions and
specific conditions in the markets we address, including the recent
significant economic slowdown in the technology sector and semiconductor
industry; the timing and successful completion of technology and product
development through volume production; the rate at which our present and
future customers and end-users adopt Broadcom's technologies and products in
the markets for wireless products; delays in the adoption and acceptance of
industry standards in those markets; the timing of customer-industry
qualification and certification of our products and the risks of
non-qualification or non-certification; the timing, rescheduling or
cancellation of significant customer orders and the ability of our customers
to manage their inventory; the loss of a key customer; the volume of our
product sales and pricing concessions on volume sales; the effectiveness of
our expense and product cost control and reduction efforts; changes in our
product or customer mix; the qualification, availability and pricing of
competing products and technologies and the resulting effects on sales and
pricing of our products; intellectual property disputes and customer
indemnification claims and other types of litigation risk; our ability to
specify, develop or acquire, complete, introduce, market and transition to
volume production new products and technologies in a timely manner; the
effects of new and emerging technologies; the availability and pricing of
third party semiconductor foundry and assembly capacity and raw materials;
fluctuations in the manufacturing yields of our third party semiconductor
foundries and other problems or delays in the fabrication, assembly, testing
or delivery of our products; the risks of producing products with new
suppliers and at new fabrication and assembly facilities; problems or delays
that we may face in shifting our products to smaller geometry process
technologies and in achieving higher levels of design integration; the risks
and uncertainties associated with our international operations, particularly
in light of recent events; our ability to retain and hire key executives,
technical personnel and other employees in the numbers, with the capabilities,
and at the compensation levels needed to implement our business and product
plans; the quality of our products and any remediation costs; the effects of
natural disasters, international conflicts and other events beyond our
control; the level of orders received that can be shipped in a fiscal quarter;
and other factors.
Our forthcoming Annual Report on Form 10-K, recent Quarterly Reports on
Form 10-Q, recent Current Reports on Forms 8-K and 8-K/A, and other Securities
and Exchange Commission filings discuss some of the important risk factors
that may affect our business, results of operations and financial condition.
We undertake no obligation to revise or update publicly any forward-looking
statements for any reason.
Broadcom(R), the pulse logo(R), Blutonium(TM) and SystemI/O(TM) are
trademarks of Broadcom Corporation and/or its affiliates in the United States
and certain other countries. Bluetooth(TM) is a trademark owned by
Telefonaktiebolaget LM Ericsson AB and licensed to participants in the
Bluetooth Special Interest Group (SIG) in the United States and certain other
countries. Wi-Fi(TM) is a trademark of the Wireless Ethernet Compatibility
Alliance. All other trademarks are the property of their respective owners.
Broadcom Public Relations Contacts
Trade Press
Henry Rael
Sr. Communications Specialist
949-585-5734
hrael@broadcom.com
Business Press
Bill Blanning or Eileen Algaze
Corporate Communications
949-585-5555 or 949-585-5971
blanning@broadcom.com
ealgaze@broadcom.com
Broadcom Investor Relations Contact
Nick Kormeluk
Director, Investor Relations
949-585-6932
nickk@broadcom.com
SOURCE Broadcom Corporation
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Related links:
http://www.broadcom.com
CONTACT:
Trade Press, Henry Rael, Sr. Communications
Specialist, +1-949-585-5734, hrael@broadcom.com, or Business
Press, Corporate Communications, Bill Blanning, +1-949-585-5555,
blanning@broadcom.com, or Eileen Algaze, +1-949-585-5971,
ealgaze@broadcom.com, or Nick Kormeluk, Director, Investor
Relations, +1-949-585-6932, nickk@broadcom.com, all of Broadcom
Corporation
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