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NEC Electronics America Showcases Wide Range of Semiconductor Solutions for Embedded Design at Embedded Systems Conference 2005

     Motor-Control, Automotive Electronics and ASIC Technology Expertise
       Highlighted at ESC and Microprocessor Summit Technical Sessions

    SANTA CLARA, Calif., March 7 /PRNewswire/ -- NEC Electronics America, Inc.
today announced it will showcase a wide range of semiconductor solutions for
embedded systems in the NEC Electronics America booth #902 at the Embedded
Systems Conference (ESC), which takes place March 6-10 at the Moscone
Convention Center in San Francisco.  NEC Electronics America will highlight
its expertise in motor-control, automotive and ASIC technologies with
presentations in the Embedded Training Program, the Design Seminar Series and
Microprocessor Summit.  Booth demonstrations and displays will feature the
company's 8- and 32-bit microcontrollers (MCUs) and development tools, Instant
Silicon Solution Platform(TM) (ISSP(TM)) high-speed interface (HSI) structured
ASIC technology, SRAM memory products and PCI Express(TM) switch and bridge
application-specific standard products (ASSPs).
    "NEC Electronics America is a leading embedded solutions supplier,
providing the high-quality, cost-effective products that customers and OEMs
need to enable their industrial, networking and consumer designs," said Bart
Ladd, general manager, standard solutions strategic business unit, NEC
Electronics America.  "As part of our ongoing commitment to providing
industry-leading products as well as embedded technology expertise, we are
exhibiting a variety of products for key embedded markets, such as motor-
control, high-speed communications and consumer applications, and we are also
pleased to be participating in four technical sessions designed to help expand
designers' knowledge and expertise in embedded system design."

    Technical Presentations

     Topic:  Choosing the Right Semiconductor Platform for Your Design
     Track:  Easy Paths to Silicon Design Seminar Series
     Time/Location:  March 7 at 8:30 a.m., Moscone Convention Center
     Presenter:  Gaku Ogura, senior marketing manager, custom LSI strategic
      business unit

     Topic:  Scalable, Highly Integrated 32-Bit RISC Family (not just) for the
      Automotive World
     Track:  Microprocessor Summit
     Time/Location:  March 7 at 3:30 p.m., Argent Hotel
     Presenter:  Jens Eltze, staff technical applications engineer, automotive
      strategic business unit

     Topic:  MCUs for Motor Control
     Track:  Embedded Training Program
     Time/Location:  March 10 at 3:45 p.m., Moscone Convention Center
     Presenter:  John Pocs, senior system application engineer, standard
      solutions strategic business unit

     Topic:  Managing the Risk of Embedded SerDes for High-Speed Network
      Applications
     Track:  Integrating Electronics and Optics in Multi-Gigabit Line Cards
      Session, Network System Design Seminar Series
     Time/Location:  March 10 at 3:45 p.m., Moscone Convention Center
     Presenter:  Vadim Shain, systems application engineering manager, custom
      LSI strategic business unit

    In addition to booth demonstrations and technical presentations, the
company will also have a golf putting game and daily drawings in its booth.

    8- and 32-Bit Microcontrollers
    NEC Electronics' 8-bit K0S and K0 families and 32-bit V850(TM) family
provide low-power, high-performance microcontroller solutions for a variety of
industrial and consumer appliance applications.  In addition, the company
simplifies application design by offering low-cost emulators featuring K0 and
K0S MCUs.  Live demonstrations highlighting the company's 8-bit 78K0 MCUs will
include a brushless DC motor-control solution and a single-phase AC motor
reference design.  There will also be a static demonstration of the company's
M-Station and micro-boards, as well as a demonstration of the NEC Electronics
IECUBE and MiniCube with N-Wire Card. More information can be found at
http://www.necelam.com/microcontrollers/home.php .

    ISSP Structured ASICs
    NEC Electronics' ISSP structured ASICs offer designers an alternative
solution for designs that require ASIC-like levels of performance with lower
development costs and quicker turnaround times.  Each NEC Electronics ISSP
design begins with a prefabricated master composed of an array of complex
multi-gates, embedded IP cores, built-in test circuits, clock domains and
power lines.  Currently available families of ISSP structured ASICs include
the 150-nm ISSP1 and ISSP1-HSI devices and the 90-nm ISSP90 devices.  A
presentation illustrating the company's HSI technology and a static evaluation
board will be featured in the booth. More information can be found at
http://www.necelam.com/asics/index.php?Subject=ISSP .

    Memory Technologies
    NEC Electronics' asynchronous and synchronous fast SRAMs, and QDR(TM)
SRAMs satisfy the demands of high-speed networks, instruments and the most
demanding processor cache applications.  The company also offers psuedo SRAMs
that enable next-generation cellular handsets and other mobile and wireless
devices.  Information on NEC Electronics' SRAM technologies will be available
at the company's booth.  More information can be found at
http://www.necelam.com/memory/index.php?Subject=Home.

    Advanced Interface Technology - PCI Express
    NEC Electronics is a leading provider of PCI Express solutions for
networking, server, workstation and PC applications.  To support this emerging
technology, the company supplies transceiver and endpoint controller IP cores
physical logic and link layer cores, as well as bridge and switch ASSPs.
Information on NEC Electronics' PCI Express products will be available at the
company's booth.  More information about the company's advanced interface
technology can be found at
http://www.necelam.com/interface/index.php?Subject=Home .

    About NEC Electronics America, Inc.
    NEC Electronics America, Inc., headquartered in Santa Clara, California,
is a wholly owned subsidiary of NEC Electronics Corporation (TSE: 6723), a
leading provider of semiconductor products encompassing advanced technology
solutions for the broadband and communications markets; system solutions for
the mobile, PC, automotive and digital consumer markets; and platform
solutions for a wide range of customer applications.  NEC Electronics America
offers a local manufacturing facility in Roseville, California, and the global
manufacturing capabilities of its parent company.  NEC Electronics America is
also the North American marketing and sales channel, specializing in
industrial applications, for active-matrix LCDs from NEC Technologies, Ltd., a
global leader in innovative display technologies.  More information about the
products offered by NEC Electronics America can be found at
http://www.necelam.com .

    NOTE:  NEC Electronics America, Instant Silicon Solution Platform, ISSP
and V850 are either trademarks or registered trademarks of NEC Electronics
Corporation in the United States and/or other countries. PCI Express is a
trademark or registered trademark of the PCI-SIG. Other product or brand names
are trademarks or registered trademarks of their respective holders.


SOURCE NEC Electronics Corporation




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  • http://www.necel.com
    CONTACT:
    Klaudeen Shemirani of NEC Electronics
    America, Inc., +1-408-588-5402, or
    klaudeen_shemirani@necelam.com; or Jessica Kerr of Porter
    Novelli, +1-408-369-4600, ext. 637, or
    jessica.kerr@porternovelli.com, for NEC Electronics America,
    Inc., for NEC Electronics America, Inc.