Recognized by EDN Innovations, EE Times ACE, and Top Semiconductor Company
Partner Awards
SANTA CLARA, Calif., March 21 /PRNewswire/ -- Clear Shape Technologies,
Inc., a leader in variability-aware analysis and optimization solutions,
today announced that their variability platform products have been
nominated for three EDA industry awards: the EDN Innovation of the Year
Award; the EE Times Annual Creativity in Electronics (ACE) Award; and one
of the top 10 semiconductor companies' Partner Award.
InShape(TM) achieved finalist standing in the EDN Innovation Award
category for IC back-end/Design for Manufacturing (DFM)/proprietary ASIC
and FPGA flows. InShape is the first model-based full-chip Design
Manufacturability Checker that predicts accurate silicon shapes, providing
designers the ability to do fast, accurate DFM hotspot detection of
catastrophic failures. Additionally, InShape produces critical dimension
(CD) reports which are a required input for fast and accurate eDFM analysis
and optimization across process window.
Clear Shape was also chosen as finalist for the EE Times ACE Awards
Design Team of the Year for its efforts on OutPerform(TM), a comprehensive
electrical DFM variability analysis and optimization solution. OutPerform
uses the silicon contours predicted by InShape and performs device
extraction to compute the difference in timing and leakage power, as well
as RC-extraction of interconnect to calculate the change in timing and
noise at the full-chip level. Using this variability-aware analysis and
optimization, designers can prevent catastrophic and parametric failures
across process window to save expensive re-spins and lost revenues.
Clear Shape's Variability Platform was selected as finalist for one of
the top 10 semiconductor companies' Partner Award. Clear Shape's
Variability Platform includes two products, InShape and OutPerform, and
allows designers to analyze and optimize the parametric and catastrophic
impact of systematic manufacturing variations. It utilizes innovative,
patented model-based technology which contains secure fab data to capture
RET, OPC, CMP, mask, etch and lithography effects on both device and
interconnect.
"Clear Shape is offering the first real DFM tool. It's the first one
targeted for the designer. All the rest have been post-GDSII tools," stated
Gary Smith, founder and chief analyst of Gary Smith EDA.
"Clear Shape is the only design-technology / DFM company that has been
nominated for three of the most prestigious awards in our industry," said
Nitin Deo, vice president of marketing and business development for Clear
Shape. "We are pleased to see that our innovative solutions are being
recognized by our peers," he added.
About the EDN Innovation Awards
The annual EDN Innovation Awards honor outstanding engineering
professionals and recognize unique, state-of-the-art electronics products
in several categories. EDN uses a combination of audience online votes,
balloting by the EDN Editorial Advisory Board, and voting by EDN's
editorial staff to determine the ultimate winners. EDN will present the
awards at a ceremony held on April 2, 2007 in San Jose.
About the EE Times ACE Awards
The EE Times ACE Awards celebrate the creators of technology who
demonstrate leadership and innovation in the global industry and shape the
world. The creators and their innovations will be recognized at the EE
Times ACE Awards Gala on April 3, 2007 as part of CMP Technology's Embedded
Systems Conference Silicon Valley, the largest electronic systems design
event in North America.
About Clear Shape
Clear Shape Technologies, Inc. is focused on delivering a complete
Variability Platform that allows designers to control and optimize the
parametric and catastrophic impact of systematic manufacturing variations.
Clear Shape products are targeted to cell-based, custom analog, IP, and
library designers using sub-90 nm processes. Clear Shape's products utilize
innovative, patented model-based technology which contains secure fab data
to capture RET, OPC, CMP, mask, etch and lithography effects on both device
and interconnect. Clear Shape's products are in the DFM qualification
programs of all three major foundry platforms. Clear Shape is backed by
top-tier venture investors that include USVP, Intel Capital and KT Ventures
(KLA Tencor). The company is headquartered at 3255-3 Scott Blvd. Suite 102,
Santa Clara, Calif. 95054. For more information, visit http://www.clearshape.com
or call +1 (408) 833- 7130.
InShape and OutPerform are registered trademarks of Clear Shape
Technologies, Inc.
SOURCE Clear Shape Technologies, Inc.
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Related links:
http://www.clearshape.com
http://www.embedded.com/esc/sv
CONTACT:
Gloria Nichols of Launch Marketing,
+1-650-851-6919, gloria@launchm.com, for Clear Shape
Technologies, Inc.
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