WEST CALDWELL, N.J., March 31 /PRNewswire-FirstCall/ -- Merrimac
Industries, Inc. (Amex: MRM), a leader in the design and manufacture of RF
Microwave components, assemblies and micro-multifunction modules (MMFM(R)),
today announced plans to release its fourth quarter and fiscal year 2004
financial results before the market opens on Friday, April 1, 2005.
Investors are invited to participate in the financial results conference
call on Friday, April 1, 2005 at 4:15 p.m. (Eastern) by dialing 1-800-231-9012
(for International callers: 1-719-457-2617) ten minutes prior to the scheduled
start time, and reference the Merrimac Industries fourth quarter 2004
conference call. For those unable to participate, a replay will be available
for seven days by dialing 1-888-203-1112, or 1-719-457-0820 for international
callers, passcode number 2706749.
This conference call will also be broadcast live over the Internet by
logging on to the web at this address:
http://phx.corporate-ir.net/playerlink.zhtml?c=73209&s=wm&e=1045642
If you are unable to participate during the live webcast, a link to the
archived webcast will be listed on the Merrimac Industries, Inc. website
http://www.merrimacind.com .
About Merrimac
Merrimac Industries, Inc. is a leader in the design and manufacture of RF
Microwave signal processing components, assemblies and subsystems, Multi-Mix
PICO(R) components and micro-multifunction modules (MMFM), serving the
wireless telecommunications industry worldwide with enabling technologies for
space, defense and commercial applications. Merrimac is focused on providing
Total Integrated Packaging Solutions(R) with Multi-Mix(R) Microtechnology, a
leading edge competency providing value to our customers through
miniaturization and integration. The Multi-Mix(R) process for microwave,
multilayer integrated MMFM circuitry is a patented method developed by
Merrimac Industries based on fluoropolymer composite substrates. The fusion
bonding of multilayer structures provides a homogeneous dielectric medium for
superior electrical performance at microwave frequencies. The bonded layers
may incorporate embedded semiconductor devices, MMICs, etched resistors,
passive circuit elements and plated-through via holes to form a
three-dimensional subsystem enclosure that requires no further packaging.
Merrimac Industries facilities are registered under ISO 9000, an
internationally developed set of quality criteria for manufacturing
operations.
Merrimac Industries, Inc. has facilities located in West Caldwell, NJ, San
Jose, Costa Rica and Ottawa, Ontario, Canada, and has approximately 240
co-workers dedicated to the design and manufacture of signal processing
components, gold plating of high-frequency microstrip, bonded stripline and
thick metal-backed Teflon (PTFE) micro-circuitry and subsystems providing
Total Integrated Packaging Solutions(R) for wireless applications. Merrimac
(MRM) is listed on the American Stock Exchange. Multi-Mix(R), Multi-Mix
PICO(R), MMFM(R) and Total Integrated Packaging Solutions(R) are trademarks of
Merrimac Industries, Inc. For more information about Merrimac Industries,
Inc. and its Canadian subsidiary Filtran Microcircuits Inc., please visit
http://www.merrimacind.com and http://www.filtranmicro.com .
Contact: Mason N. Carter, Chairman & CEO
mnc@merrimacind.com
973-575-1300, ext. 1202
SOURCE Merrimac Industries, Inc.
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Related links:
http://www.merrimacind.com
Company News On-Call:
http://www.prnewswire.com/comp/567525.html
CONTACT:
Mason N. Carter, Chairman & CEO of Merrimac
Industries, Inc., +1-973-575-1300, ext. 1202, mnc@merrimacind.com
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