WEST CALDWELL, N.J., March 31 /PRNewswire-FirstCall/ -- Merrimac
Industries, Inc. (Amex: MRM), today announced that it has been granted a
patent for its Multi-Mix(R) Microtechnology from the State Intellectual
Property Office of the People's Republic of China entitled "Method of Making
Microwave Multifunction Modules Using Fluoropolymer Composite Substrates".
Chairman and CEO Mason N. Carter commented, "This patent further supports
our Multi-Mix(R) Product/Market Strategy and enhances our intellectual
property in one of the key growth areas in the global economy and facilitates
our ability to secure manufacturing and licensing arrangements in China. This
patent covers products such as low cost integrated power amplifiers and radio
transceivers for wireless infrastructure and WiMAX base stations in the 450
MHz - 3.7 GHz range as well as Microwave and Millimeterwave line of sight
(LOS) digital radios and backhaul systems."
Mr. Carter continued, "There is growing trend in the wireless
infrastructure industry to integrate base station power amplifiers and radio
transceivers. This trend is in line with our Multi-Mix(R) high power
integrated platform strategy to replace labor intensive and expensive discrete
RF subsystems such as power amplifiers, radio transceivers, tower mount
antennas (TMAs), with low cost, compact, and light weight integrated
solutions. This patent enhances Merrimac's position as a pioneer in the global
wireless infrastructure industry offering the industry's first integrated
radio transceivers, power amplifiers and transmit and receive (T/R) modules
for base station and tower top applications. This patent enhances our
competitive position to establish significant partnerships with major base
station OEMs in China enabling Merrimac to participate with its advanced
integrated high power amplifier technology in a growing number of base station
opportunities.
Mr. Carter further noted, "Multi-Mix(R) Microtechnology is an innovative
proprietary enabling platform technology developed exclusively for integration
of RF, Microwave and Millimeterwave circuits, multifunction modules and
subsystems where high RF power handing capability and superior thermal
management are performance critical. Multi-Mix(R) integrated platform
technology is based on a proprietary multilayer PTFE process whereby
fluoropolymer composite substrates of different dielectric constant and
thickness are fusion bonded together to form a highly robust multilayer
structure. The fusion bonding process yields a highly reliable homogeneous
multilayer stripline structure with superior electrical and thermal
performance across a wide frequency and power range. The Multi-Mix(R) fusion
bonded multilayer structure is an enabling platform for embedding a wide range
of RF and Microwave semiconductor chips such as LDMOS, GaAs FET/MESFET and
PHEMT, GaN, SiC, and SiGe, etc., eliminating expensive discrete packages. This
enabling platform offers the capability to replace complex RF power amplifier
circuitry with low cost integrated modules, dramatically improving reliability
and peak power handling. Furthermore, by incorporating other active as well as
passive circuit elements, etched resistors, and plated-through via holes a
three-dimensional subsystem enclosure can be formed that requires no further
packaging resulting in significantly smaller, low cost and light weight
products with enhanced reliability and superior electrical and thermal
performance."
About Merrimac
Merrimac Industries, Inc. is a leader in the design and manufacture of RF
Microwave signal processing components, subsystem assemblies, and Multi-Mix(R)
micro-multifunction modules (MMFM(R)), for the worldwide Defense, Satellite
Communications (Satcom), Commercial Wireless and Homeland Security market
segments. Merrimac is focused on providing Total Integrated Packaging
Solutions(R) with Multi-Mix(R) Microtechnology, a leading edge competency
providing value to our customers through miniaturization and integration.
Multi-Mix(R) MMFM(R) provides a patented and novel packaging technology that
employs a platform modular architecture strategy that incorporates embedded
semiconductor devices, MMICs, etched resistors, passive circuit elements and
plated-through via holes to form a three-dimensional integrated module used in
High Power, High Frequency and High Performance mission-critical applications.
Merrimac Industries facilities are registered under ISO 9001:2000, an
internationally developed set of quality criteria for manufacturing
operations.
Merrimac Industries, Inc. has facilities located in West Caldwell, NJ, San
Jose, Costa Rica and Ottawa, Ontario, Canada, and has approximately 240
co-workers dedicated to the design and manufacture of signal processing
components, gold plating of high-frequency microstrip, bonded stripline and
thick metal-backed Teflon (PTFE) micro-circuitry and subsystems providing
Total Integrated Packaging Solutions(R) for wireless applications. Merrimac
(MRM) is listed on the American Stock Exchange. Multi-Mix(R), Multi-Mix
PICO(R), MMFM(R), System In A Package(R), SIP(R) and Total Integrated
Packaging Solutions(R) are registered trademarks of Merrimac Industries, Inc.
For more information about Merrimac Industries, Inc. and its Canadian
subsidiary Filtran Microcircuits Inc., please visit http://www.merrimacind.com
and http://www.filtranmicro.com .
This press release contains statements relating to future results of the
Company (including certain projections and business trends) that are "forward-
looking statements" as defined in the Private Securities Litigation Reform Act
of 1995. Actual results may differ materially from those projected as a result
of certain risks and uncertainties. These risks and uncertainties include,
but are not limited to: risks associated with demand for and market acceptance
of existing and newly developed products as to which the Company has made
significant investments, particularly its Multi-Mix(R) products; the
possibilities of impairment charges to the carrying value of our Multi-Mix(R)
assets, thereby resulting in charges to our earnings; slower than anticipated
penetration into the satellite communications, defense and wireless markets;
failure of our Original Equipment Manufacturer, or OEM, customers to
successfully incorporate our products into their systems; changes in product
mix resulting in unexpected engineering and research and development costs;
delays and increased costs in product development, engineering and production;
reliance on a small number of significant customers; the emergence of new or
stronger competitors as a result of consolidation movements in the market; the
timing and market acceptance of our or our OEM customers' new or enhanced
products; general economic and industry conditions; the risk that the benefits
expected from the Company's acquisition of Filtran Microcircuits Inc. are not
realized; the ability to protect proprietary information and technology;
competitive products and pricing pressures; our ability and the ability of our
OEM customers to keep pace with the rapid technological changes and short
product life cycles in our industry and gain market acceptance for new
products and technologies; foreign currency fluctuations between the U.S. and
Canadian dollars; risks relating to governmental regulatory actions in
communications and defense programs; and inventory risks due to technological
innovation and product obsolescence, as well as other risks and uncertainties
as are detailed from time to time in the Company's Securities and Exchange
Commission filings. These forward-looking statements are made only as of the
date hereof, and the Company undertakes no obligation to update or revise the
forward-looking statements, whether as a result of new information, future
events or otherwise.
Contact: Mason N. Carter, Chairman & CEO
973-575-1300, ext. 1202
mnc@merrimacind.com
SOURCE Merrimac Industries, Inc.
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Related links:
http://www.merrimacind.com
Company News On-Call:
http://www.prnewswire.com/comp/567525.html
CONTACT:
Mason N. Carter, Chairman & CEO of Merrimac
Industries, Inc., +1-973-575-1300, ext. 1202, mnc@merrimacind.com
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