PROVIDENCE, R.I., April 15 /PRNewswire/ -- SPECTRA SYSTEMS today announced
that it had been issued US Patent #6,370,316 B1 for detecting the presence
and thickness of a substrate, such as currency paper, in a high speed, non-
contact manner.
This method and system provides an improved technique to accurately detect
the presence of more than one item at a particular point along a high velocity
transport path. Precise measurement of substrate thickness solves the problem
of inaccurate counts due to thin paper or paper-like substrates such as
banknotes bunching or sticking together while being transported.
Commenting on the award, Nabil M. Lawandy, Ph.D., Spectra Systems CEO and
co-inventor of the technique stated, "We are pleased to have been awarded this
US patent for note thickness sensing based on optical methods. The approach
is readily integrated with other optical platforms allowing for effective
sensor fusion and reduced sensor real estate on document processing machines.
About Spectra Systems
Spectra Systems Corporation, headquartered in Providence, RI is a market
driven company that is changing the way businesses mark, sense, track and
authenticate their products from production line to point of purchase. Its
cross-platform technologies, based on advanced materials and proprietary
hardware and software systems, offer an integrated approach that provides
customers with complete solutions.
SOURCE Spectra Systems Corporation
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Related links:
http://www.spectra-science.com
CONTACT:
Thomas R. Pizzuti, Director, Business
Development of Spectra Systems Corporation, +1-401-274-4700, or
tpizzuti@spsy.com
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