Special Exhibit Area Focused on New Technologies and Market Opportunities
in Test, Assembly and Packaging at SEMICON West 2006 July 11-13
SAN JOSE, Calif., May 4 /PRNewswire/ -- SEMI today announced additional
details for its upcoming Test, Assembly and Packaging TechXPOT, located in
West Hall Level 2 of the Moscone Center during SEMICON West 2006, July
11-13 in San Francisco. Building on the "show-within-a-show" concept, the
Test, Assembly and Packaging TechXPOT is a special area focusing on
innovations in test, assembly and packaging, with exhibits, displays and
exhibitor presentations on the topic. In addition, the Test, Assembly and
Packaging TechXPOT will feature presentations from select winners of the
fourth annual Technology Innovation Showcase (TIS), as well as two detailed
roadmap sessions.
In a continuous effort to build a stronger and higher quality
curriculum, SEMI has partnered with leading industry associations and
companies including FSA, the International Electronic Manufacturing
Initiative (iNEMI), the Microelectronics Packaging and Test Engineering
Council (MEPTEC) and TechSearch International to create the Test, Assembly
and Packaging TechXPOT at SEMICON West 2006.
"Many major IC device manufacturers call the U.S. home for their
research and development facilities. Because of this, test, assembly and
packaging is becoming an increasingly strategic consideration, and
therefore, a fundamental element of SEMICON West 2006," said John Ellis,
senior director of standards, technology and market research, SEMI. "With
this in mind, the Test, Assembly and Packaging TechXPOT offers the perfect
forum for showcasing innovative new technologies, networking and discussing
market trends."
A dedicated display area will feature examples of the latest packaging
technologies. Additionally, the TechXPOT will house a stage for TIS winners
and select exhibitors to present technical content and solutions. Sessions
include: test roadmaps and design for test, organized by SEMI; user
packaging roadmaps, organized by MEPTEC; fabless roadmaps, organized by
FSA; and a lead- free seminar, organized by iNEMI and TechSearch
International. Additionally, buses from SEMI headquarters located in San
Jose will be available for attendees who would like to attend SEMICON West.
The shuttle is free, however registration will be required.
Topics for the first of the two Test, Assembly and Packaging sessions
include: Drivers and Challenges for Packaging of Next Generation FPGAs,
featuring Tarun Verma, director of packaging technology at Altera; ASICs
Packaging Roadmap, featuring Maniam Alagaratnam, vice president of package
development at LSI Logic; Critical Package Requirements for Advanced
Manufacturing Flow, featuring Bo Chang, packaging engineering director at
Cypress; and Mil-Aero Electronics, featuring Tom Clifford, advanced
packaging director at Lockheed Martin.
The second Test, Assembly and Packaging session will cover: Modeling
for Material Sets in Semiconductor Packaging Assembly, featuring Jack
Zhang, Ph.D., materials scientist at Henkel Corporation; Impact of
Application Surface on the Development of TIMs, featuring Devesh Mathur,
director of global technology at Honeywell; Electronic Packaging Materials,
featuring Jonathan Harris, president of CMC Interconnect Technologies; and
a Global Semiconductor Packaging Materials Outlook, featuring Dan Tracy,
senior director of industry research & statistics at SEMI.
The TechXPOT will house the TIS winners from the test, assembly and
packaging markets. TIS winners in test, assembly and packaging are jury-
selected for their relevance to the industry, and represent the highest
level of innovation in their respective fields. Winners for 2006 include
Advanced Material Sciences, Inc. (AMS), Aguila Technologies, Deep
Photonics, ICOS Vision Systems, Microbonds, Inc., Segin Semiconductor
Solutions, Synova SA and Xradia, Inc.
For more information about the Test, Assembly and Packaging TechXPOT,
and SEMICON West 2006, please visit http://www.semi.org/semiconwest.
SEMI is a global industry association serving companies that provide
equipment, materials and services used to manufacture semiconductors,
displays, nano-scaled structures, micro-electromechanical systems (MEMS)
and related technologies. SEMI maintains offices in Austin, Beijing,
Brussels, Hsinchu, Moscow, San Jose (California), Seoul, Shanghai,
Singapore, Tokyo and Washington, D.C. For more information, visit
http://www.semi.org.
SOURCE SEMI
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Related links:
http://www.semi.org/
CONTACT:
Scott Smith, +1-408-943-7957, or
ssmith@semi.org, or John Ellis, +1-512-241-4075, or
jellis@semi.org, both of SEMI
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