Print This Story  Email This Story  Save this Link View PR Newswire's RSS Feed  Blogs Discussing this News Release  Search Blogs that Mention this News Release  Click this link to view linked Bookmarking Services Click this link to view linked Blogging Services


Surfect Wins Technology Innovation Award from SEMI

            Award Highlights Technology Breakthrough By Surfect

    ALBUQUERQUE, N.M., May 7 /PRNewswire-FirstCall/ -- Surfect Holdings,
Inc. (OTC Bulletin Board: SUFH.OB) announced today its wholly-owned
subsidiary, Surfect Technologies, Inc. (Surfect), a provider of patented
and proprietary cost-effective electroplating tools and processes to
semiconductor chip manufacturers, has been awarded the Technology
Innovation Award from SEMI for its revolutionary Ascent 200 plating
machine. SEMI's Technology Innovation Showcase (TIS) spotlights companies
advancing Moore's Law to its limits and beyond. Winners are selected by a
jury of expert technologists, including past Showcase winners. Surfect's
technology will be highlighted in a special TIS location during SEMICON
West-SEMI's North America and largest event for microelectronics
manufacturing. Surfect will also be presenting its tool and key process
technology. SEMICON West attracts the world's leading innovation companies
that are responsible for the technologies, which enable the
microelectronics that drive today's most sophisticated consumer and
commercial electronic products.
    "This award is definitely an important milestone for the Surfect team,"
said Steve Anderson, President and CEO. "We are receiving a very positive
response from our customers as we demonstrate our new tools. We are
confident that our more cost effective technology approach will help
advance miniaturization efforts through wafer level packaging as well as 3D
packaging technology development."
    The Ascent 200 is an innovative single-cell electroplating tool and
process, which enables low-cost manufacturing of flip chip bumps and other
metal deposition needs on wafers (200mm or 300mm) at high speeds. This
innovative technology provides customers with the high utilization rates
needed to meet the demanding production requirements of wafer bumping,
through-hole via plating, and multi-metal stacking configurations.
Packaging miniaturization is a key strategic business thrust for Surfect
and its customers.
    SEMICON West 2007 will feature well over 1,000 exhibiting companies,
representing 23 countries. SEMI is a global industry association serving
companies that provide equipment, materials and services used to
manufacture semiconductors, displays, nano-scaled structures,
micro-electromechanical systems (MEMS) and related technologies.
    About Surfect Holdings, Inc.
    Surfect Holdings, through its wholly-owned operating subsidiary,
Surfect Technologies, Inc., designs and manufacturers an innovative and
revolutionary single-cell electroplating tool and process that utilizes the
semiconductor industry's first programmable Plating Computer(TM). Surfect's
machines fabricate high performance, low-cost interconnects, providing
immediate solutions to the back-end of the semiconductor manufacturing
process. Surfect currently has been issued three patents and has six
patents pending. Additional information is available on the Surfect
Technologies Website at http://www.surfect.com.
    Safe Harbor
    Certain statements contained in this press release are "forward-looking
statements" within the meaning of applicable federal securities laws,
including, without limitation, anything relating or referring to future
financial results and plans for future business development activities, and
are thus prospective. Forward-looking statements are inherently subject to
risks and uncertainties, some of which cannot be predicted or quantified
based on current expectations. Such risks and uncertainties include,
without limitation, the risks and uncertainties set forth from time to time
in reports filed by the company with the Securities and Exchange
Commission. Although the company believes that the expectations reflected
in such forward-looking statements are reasonable, it can give no assurance
that such expectations will prove to have been correct. Consequently,
future events and actual results could differ materially from those set
forth in, contemplated by, or underlying the forward-looking statements
contained herein. The company undertakes no obligation to publicly release
statements made to reflect events or circumstances after the date hereof.
    Contacts
    Company:
    Mark Eichhorn, Surfect Technologies, Inc.
    Email - meichhorn@surfect.com, ph - (215) 693-6240

    Investor Relations:
    Terry McGovern, Vision Advisors, Inc.
    Email - mcgovern@visionadvisors.net, ph - (415) 902-3001
    or
    Bryan Smyth, Smyth Consulting Group
    Email - smythconsulting@sbcglobal.net, ph - (858) 480-2880

    Marketing:
    Jody Mahaffey, JDM Resources
    Email - jody@jdmresources.com, ph - (480) 216-5049


SOURCE Surfect Holdings, Inc.




Back to Topback to top

Related links:
  • http://www.surfect.com
  • http://semiconwest.semi.org/index.htm
    CONTACT:
    Company: Mark Eichhorn of Surfect
    Technologies, Inc., +1-215-693-6240, meichhorn@surfect.com;
    Investor Relations: Terry McGovern of Vision Advisors, Inc.,
    +1-415-902-3001, mcgovern@visionadvisors.net, or Bryan Smyth of
    Smyth Consulting Group, +1-858-480-2880,
    smythconsulting@sbcglobal.net; or Marketing: Jody Mahaffey of JDM
    Resources, +1-480-216-5049, jody@jdmresources.com