Nineteen Recipients Showcase New Innovations in Emerging Technologies,
Wafer Processing and Test, Assembly and Packaging
SAN JOSE, Calif., May 8 /PRNewswire/ -- SEMI today announced the
Technology Innovation Showcase Award winners for 2007. Nineteen award
winners make up the 5th annual showcase, and will deliver exclusive
presentations in the various TechXPOTS during SEMICON West 2007. This
year's recipients are grouped into 3 categories: Emerging Technologies,
Wafer Processing and Test, Assembly and Packaging. They were selected by a
jury of industry experts based on technical merit, commercialization
potential, as well as the potential impact the innovation will have on the
semiconductor and related industries.
Companies in the Emerging Technologies category feature diamond on
silicon substrates, an EUV light source, software that models the
electrical properties of nanoscale systems, a small atomic force microscope
for production and diagnostic applications, a new process for copper
interconnects, and a high volume imprint lithography system for advanced
micro and nano structures based on Nanoimprint Lithography (NIL) among
others.
The Test, Assembly and Packaging category innovations include
technology for advanced organic packaging, an automated 2D/3D inspection
system, a high- speed electrolytic plating process, an integrated tool set
used to enable accelerated yield ramps, and a vertical probe card for
advanced flip chip devices.
In the Wafer Processing category companies are introducing test wafers
with 45 nm arrays, variable batch ALD systems, environmentally friendly
removal chemistry, an XPS-based product wafer thin-film metrology system, a
system to measure offsets and teach wafer transfer systems, and software
tools for automatic physical layout optimization.
"For the past three years, the Innovation Showcase has helped to
highlight companies with significant new products that may change the
micro- and nanoelectronics industries," said Victoria Hadfield, president
of SEMI North America. "Our goal is to speed these innovations to market by
assisting winners in the identification of potential customers, partners
and funding sources."
TIS winners will discuss their new technologies at the TechXPOT stages
during SEMICON West 2007. TechXPOTS are "shows-within-the-show" that
feature exhibits, products and free live technical presentations for
visitors at SEMICON West.
This full list of recipients is as follows: (for additional details on
product submissions, see editor's note below)
Emerging Technologies and Markets
-- Advanced Diamond Technologies
-- Atomistix Inc
-- Energetiq
-- Karma Technology, Inc
-- Nano Cluster Devices, Ltd.
-- Obducat AB
Test, Assembly and Packaging
-- Inovys Corporation
-- Jacket Micro Devices
-- SolVision Inc.
-- Surfect Technologies, Inc.
-- Wentworth Laboratories
Wafer Processing
-- ATDF
-- Aviza Technologies
-- CyberOptics
-- EKC Technology
-- GE Sensing
-- Mears Technologies
-- ReVera, Inc.
-- Takumi Technology Corp
For more information about the Technology Innovation Showcase award and
its recipients, please visit http://www.semiconwest.org.
SEMI is a global industry association serving companies that provide
equipment, materials and services used to manufacture semiconductors,
displays, nano-scaled structures, micro-electromechanical systems (MEMS)
and related technologies. SEMI maintains offices in Austin, Beijing,
Brussels, Hsinchu, Moscow, San Jose (California), Seoul, Shanghai,
Singapore, Tokyo and Washington, D.C. For more information, visit
http://www.semi.org.
SOURCE SEMI
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Related links:
http://www.semi.org/
CONTACT:
Scott Smith of SEMI, +1-408-943-7957,
ssmith@semi.org
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