WEST CALDWELL, N.J., May 14 /PRNewswire-FirstCall/ -- Merrimac Industries,
Inc. (Amex: MRM), a leader in the design and manufacture of RF Microwave
components, assemblies and micro-multifunction modules (MMFM(R)), today
announced plans to release its first quarter 2004 financial results before the
market opens on Monday, May 17, 2004.
Investors are invited to participate in the financial results conference
call on Monday May 17, 2004 at 4:15 p.m. (Eastern) by dialing 1-800-915-4836
(for International callers: 1-973-317-5319) ten minutes prior to the scheduled
start time, and reference the Merrimac Industries first quarter 2004
conference call. For those unable to participate, a replay will be available
for seven days by dialing 1-800-428-6051, or 1-973-709-2089 for international
callers, passcode number 356344.
This conference call will also be broadcast live over the Internet by
logging on to the web at this address:
http://www.firstcallevents.com/service/ajwz406793022gf12.html
If you are unable to participate during the live webcast, a link to the
archived webcast will be listed on the Merrimac Industries, Inc. website
http://www.merrimacind.com .
About Merrimac
Celebrating its 50th anniversary, Merrimac Industries, Inc. is a leader in
the design and manufacture of Multi-Mix PICO(TM) RF Microwave components,
assemblies and micro-multifunction modules (MMFM), serving the wireless
telecommunications industry worldwide with enabling technologies for space,
defense and commercial applications. Merrimac is focused on providing Total
Integrated Packaging Solutions(R) with Multi-Mix(R) Microtechnology, a leading
edge competency providing value to our customers through miniaturization and
integration. The Multi-Mix(R) process for microwave, multilayer integrated
MMFM circuitry is a patented method developed by Merrimac Industries based on
fluoropolymer composite substrates. The fusion bonding of multilayer
structures provides a homogeneous dielectric medium for superior electrical
performance at microwave frequencies. The bonded layers may incorporate
embedded semiconductor devices, MMICs, etched resistors, passive circuit
elements and plated-through via holes to form a three-dimensional subsystem
enclosure that requires no further packaging. Merrimac Industries facilities
are registered under ISO 9000, an internationally developed set of quality
criteria for manufacturing operations.
Merrimac Industries, Inc. and its subsidiary Filtran Microcircuits Inc.,
are located in West Caldwell, NJ, San Jose, Costa Rica and Ottawa, Ontario,
Canada, and have approximately 230 co-workers dedicated to the design and
manufacture of signal processing components, gold plating of high-frequency
microstrip, bonded stripline and thick metal-backed Teflon (PTFE)
micro-circuitry and subsystems providing Total Integrated Packaging
Solutions(R) for wireless applications. Merrimac (MRM) is listed on the
American Stock Exchange. Multi-Mix(R), Multi-Mix PICO(TM), MMFM(R) and Total
Integrated Packaging Solutions(R) are trademarks of Merrimac Industries, Inc.
For more information about Merrimac Industries, Inc. and Filtran Microcircuits
Inc., please visit http://www.merrimacind.com and http://www.filtranmicro.com.
Contact: Mason N. Carter, Chairman & CEO
mnc@merrimacind.com
973-575-1300, ext. 1202
SOURCE Merrimac Industries, Inc.
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Related links:
http://www.merrimacind.com
http://www.filtranmicro.com
Company News On-Call:
http://www.prnewswire.com/comp/567525.html
Audio:http://www.firstcallevents.com/service/ajwz406793022gf12.html
CONTACT:
Mason N. Carter, Chairman & CEO of Merrimac
Industries, Inc., +1-973-575-1300, ext., 1202, or
mnc@merrimacind.com
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