WEST CALDWELL, N.J., June 13 /PRNewswire-FirstCall/ -- Merrimac
Industries, Inc. (Amex: MRM), a leader in the design and manufacture of RF
Microwave components, subsystem assemblies and micro-multifunction modules
(MMFM(R)), today announced it has been granted a patent for its
Multi-Mix(R) Microtechnology from the United States Patent and Trademark
Office entitled "Coupler Resource Module."
(Photo: http://www.newscom.com/cgi-bin/prnh/20060613/NYTU005 )
The advanced capabilities of Multi-Mix(R) proprietary integrated
platform technology provide low cost high-power RF amplifier circuitry with
best in class performance and density in small lightweight modules. The
Resource Module is the foundation or the building block for providing Total
Integrated Platform Solutions for a wide range of RF and Microwave
subsystems. Based on Multi-Mix(R) proprietary PTFE process technology the
Resource Module paves the way for direct integration of high power RF
circuitry with transistor die in small lightweight modules thereby
eliminating discrete transistor packages and solutions.
Using this pioneering technology, high power amplifier assemblies can
be replaced with small, low-cost integrated power amplifier modules
exhibiting higher electrical performance and a level of reliability
previously unattainable using traditional technologies. The resource module
exhibits high temperature resistance, thermal stability and superior
homogeneity. These characteristics potentially offer the best platform
solution for high power amplifier applications for wireless infrastructure
and WiMAX base stations, radar transmitters, digital TV transmitters,
Homeland Security base stations, etc.
The Multi-Mix(R) PTFE structure of the resource module is CTE matched
with a wide range of semiconductor technologies such as LDMOS, GaN, SiC,
SiGe, GaAs FET/MESFET and PHEMT, and allows for mixed and multiple die
integration on a single platform. The potential applications of the
Resource Module exceed those of high power amplifiers. High power PIN diode
switches, attenuators, and oscillators as well as radio transceivers, phase
shifters, and phased array radar elements for both commercial and military
applications can now be integrated in small, low-cost surface mount modules
with internal fusion bonded heatsink. The Resource Module is where RF power
semiconductor chip and the high power RF circuitry directly converge onto
one platform.
Chairman and CEO Mason N. Carter commented, "We see an increasing trend
towards integration of base station RF subsystems, and our Resource Module
is in the right place at the right time to meet market needs and
challenges. Consistent and stable production of high power integrated
module products by virtue of low-cost Multi-Mix(R) manufacturing will help
our customers achieve price leadership. We expect the Resource Module to
play a key role in our future offerings as we seek to grow our market
share."
Mr. Carter further commented, "By introducing the Resource Module to
the marketplace we are already creating a paradigm shift in the design and
integration of high power RF amplifiers for wireless infrastructure base
stations. The value benefit our Resource Module offers base station OEMs in
such applications as power amplifiers, tower-mounted boosters and T/R
modules far exceeds the cost of goods of corresponding discrete solutions.
These benefits include size and weight reduction of base station equipment,
opportunities for higher level of integration, reduced development costs,
reduced time-to-market, and all in all enables OEMs to realize significant
cost savings."
Mr. Carter also commented, "Due to the high power, small size,
lightweight, low cost, and integrated platform flexibility of the Resource
Module, we have just started to explore potential applications in Unmanned
Air Vehicles (UAV's)."
About Merrimac
Merrimac Industries, Inc. is a leader in the design and manufacture of
RF Microwave signal processing components, subsystem assemblies, and
Multi-Mix(R) micro-multifunction modules (MMFM(R)), for the worldwide
Defense, Satellite Communications (Satcom), Commercial Wireless and
Homeland Security market segments. Merrimac is focused on providing Total
Integrated Packaging Solutions(R) with Multi-Mix(R) Microtechnology, a
leading edge competency providing value to our customers through
miniaturization and integration. Multi-Mix(R) MMFM(R) provides a patented
and novel packaging technology that employs a platform modular architecture
strategy that incorporates embedded semiconductor devices, MMICs, etched
resistors, passive circuit elements and plated-through via holes to form a
three-dimensional integrated module applicable to High Power, High
Frequency and High Performance mission-critical applications. Merrimac
Industries facilities are registered under ISO 9001:2000, an
internationally developed set of quality criteria for manufacturing
operations.
Merrimac Industries, Inc. has facilities located in West Caldwell, NJ,
San Jose, Costa Rica and Ottawa, Ontario, Canada, and has approximately 230
co-workers dedicated to the design and manufacture of signal processing
components, gold plating of high-frequency microstrip, bonded stripline and
thick metal-backed Teflon (PTFE) micro-circuitry and subsystems providing
Total Integrated Packaging Solutions(R) for wireless applications. Merrimac
(MRM) is listed on the American Stock Exchange. Multi-Mix(R), Multi-Mix
PICO(R), MMFM(R) and Total Integrated Packaging Solutions(R) are trademarks
of Merrimac Industries, Inc. For more information about Merrimac
Industries, Inc. and its Canadian subsidiary Filtran Microcircuits Inc.,
please visit http://www.merrimacind.com and http://www.filtranmicro.com .
This press release contains statements relating to future results of
the Company (including certain projections and business trends) that are
"forward- looking statements" as defined in the Private Securities
Litigation Reform Act of 1995. Actual results may differ materially from
those projected as a result of certain risks and uncertainties. These risks
and uncertainties include, but are not limited to: risks associated with
demand for and market acceptance of existing and newly developed products
as to which the Company has made significant investments, particularly its
Multi-Mix(R) products; the possibilities of impairment charges to the
carrying value of our Multi-Mix(R) assets, thereby resulting in charges to
our earnings; risks associated with adequate capacity to obtain raw
materials and reduced control over delivery schedules and costs due to
reliance on sole source or limited suppliers; slower than anticipated
penetration into the satellite communications, defense and wireless
markets; failure of our Original Equipment Manufacturer, or OEM, customers
to successfully incorporate our products into their systems; changes in
product mix resulting in unexpected engineering and research and
development costs; delays and increased costs in product development,
engineering and production; reliance on a small number of significant
customers; the emergence of new or stronger competitors as a result of
consolidation movements in the market; the timing and market acceptance of
our or our OEM customers' new or enhanced products; general economic and
industry conditions; the risk that the benefits expected from the Company's
acquisition of Filtran Microcircuits Inc. are not realized; the ability to
protect proprietary information and technology; competitive products and
pricing pressures; our ability and the ability of our OEM customers to keep
pace with the rapid technological changes and short product life cycles in
our industry and gain market acceptance for new products and technologies;
foreign currency fluctuations between the U.S. and Canadian dollars; risks
relating to governmental regulatory actions in communications and defense
programs; and inventory risks due to technological innovation and product
obsolescence, as well as other risks and uncertainties as are detailed from
time to time in the Company's Securities and Exchange Commission filings.
These forward-looking statements are made only as of the date hereof, and
the Company undertakes no obligation to update or revise the
forward-looking statements, whether as a result of new information, future
events or otherwise.
Contact: Mason N. Carter, Chairman & CEO
973-575-1300, ext. 1202
mnc@merrimacind.com
SOURCE Merrimac Industries, Inc.
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Related links:
http://www.merrimacind.com
http://www.filtranmicro.com
Photo Notes:
NewsCom: http://www.newscom.com/cgi-bin/prnh/20060613/NYTU005
AP Archive: http://photoarchive.ap.org AP PhotoExpress
Network: PRN1 PRN Photo Desk, photodesk@prnewswire.com
http://www.prnewswire.com/comp/567525.html /
CONTACT:
Mason N. Carter, Chairman & CEO of Merrimac
Industries, Inc., +1-973-575-1300, ext. 1202, mnc@merrimacind.com
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