Delphi Connection Systems' press-fit, solder-free termination approach
allows for numerous performance benefits in Connector-to-PCB mating
WARREN, Ohio, June 19 /PRNewswire/ -- Delphi Corporation is bringing to
market another advancement to the automotive connection systems market,
strengthening its already robust product portfolio with the launch of its
press-fit compliant pin technology.
(Logo: http://www.newscom.com/cgi-bin/prnh/20020315/DEF002LOGO )
A termination approach more widely exhibited in the telecom and
aerospace industries, press-fit compliant pins provide a solder-less
electrical connection, bringing together a connector component and a
printed circuit board (PCB). Delphi Connection Systems has developed
press-fit compliant pins that can be integrated into vehicle manufacturers'
device interconnect applications and integrated connector/module housings.
In short, a press-fit connection is made between a PCB with a plated
through-hole and a connector sporting comparatively oversized compliant
pins. Delphi Connection Systems' compliant pin technology is characterized
by the eye-of-the-needle design, which was selected due to its performance,
reliability, manufacturability and cost attributes.
John McClearn, managing director of Delphi Connection Systems North
America, noted that termination through compliant pin utilization allows
automotive customers to realize a number of performance benefits, coupling
environmental highlights with differentiating quality attributes in a
manner that provides greater manufacture and design simplification.
"This technology allows customers a single-point answer for mechanical
integration, thus enabling them to focus key resources on their core
electronics competency. Mechanical attachment is simplified, and full
repair capability is available through the easy exchange of connectors and
contacts," said McClearn, adding that Delphi Connection Systems' compliant
pins enhance overall flexibility by allowing for double-sided PCB
capability.
According to Adam Kemp, Delphi Connection Systems product manager,
"Because compliant pins are solder-free and lead-free, they can help OEMs
meet key environmental objectives."
"In addition to productivity enhancements, compliant pin products may
offer a much better value to our customers faced with increasing capital
demands needed for compliance," said Kemp. The elimination of the soldering
process may help automakers' efforts to conform to existing and impending
regulations, specifically the imperatives to eliminate lead in products and
manufacturing systems. Those regulations include the European Union's RoHs,
WEEE, and ELV initiatives, among others.
Delphi Connection Systems currently offers select integrated seal
modules with both straight- and right-angle header configurations. Future
developments include USCAR unsealed compliant pin headers that can serve as
drop in replacements for existing soldered applications.
Typical applications for Delphi Connection Systems' press-fit compliant
pins technology include the automotive telematics, infotainment,
powertrain, and body electronics markets. Specifically, the technology can
be integrated into engine, transmission and airbag control modules,
antilock brake systems, key fobs, and impact sensors, among others.
At Delphi, we help make cars safer, cleaner, more efficient, and fun to
drive. For more information about Delphi Corporation (Pink Sheets: DPHIQ),
visit http://www.delphi.com .
FORWARD-LOOKING STATEMENT
This press release, as well as other statements made by Delphi may
contain forward-looking statements within the "safe harbor" provisions of
the Private Securities Litigation Reform Act of 1995, that reflect, when
made, the company's current views with respect to current events and
financial performance. Such forward-looking statements are and will be, as
the case may be, subject to many risks, uncertainties and factors relating
to the company's operations and business environment which may cause the
actual results of the company to be materially different from any future
results, express or implied, by such forward-looking statements. Factors
that could cause actual results to differ materially from these
forward-looking statements include, but are not limited to, the following:
the ability of the company to continue as a going concern; the ability of
the company to operate pursuant to the terms of the debtor-in-possession
("DIP") financing facility; the company's ability to obtain court approval
with respect to motions in the chapter 11 proceeding prosecuted by it from
time to time; the ability of the company to develop, prosecute, confirm and
consummate one or more plans of reorganization with respect to the Chapter
11 cases; risks associated with third parties seeking and obtaining court
approval to terminate or shorten the exclusivity period for the company to
propose and confirm one or more plans of reorganization, for the
appointment of a chapter 11 trustee or to convert the cases to chapter 7
cases; the ability of the company to obtain and maintain normal terms with
vendors and service providers; the company's ability to maintain contracts
that are critical to its operations; the potential adverse impact of the
Chapter 11 cases on the company's liquidity or results of operations; the
ability of the company to execute its business plans, including the
transformation plan described in the Company's March 31, 2006 press
release, and to do so in a timely fashion; the ability of the company to
attract, motivate and/or retain key executives and associates; the ability
of the company to avoid or continue to operate during a strike, or partial
work stoppage or slow down by any of its unionized employees; and the
ability of the company to attract and retain customers. Other risk factors
are listed from time to time in the company's United States Securities and
Exchange Commission reports, including, but not limited to the Annual
Report on Form 10-K for the year ended December 31, 2004, and its most
recent quarterly report on Form 10-Q for the quarter ended September 30,
2005, and current reports on Form 8-K. Delphi disclaims any intention or
obligation to update or revise any forward-looking statements, whether as a
result of new information, future events and/or otherwise.
Similarly, these and other factors, including the terms of any
reorganization plan ultimately confirmed, can affect the value of the
company's various pre-petition liabilities, common stock and/or other
equity securities. Additionally, no assurance can be given as to what
values, if any, will be ascribed in the bankruptcy proceedings to each of
these constituencies. A plan of reorganization could result in holders of
Delphi's common stock receiving no distribution on account of their
interest and cancellation of their interests. Under certain conditions
specified in the Bankruptcy Code, a plan of reorganization may be confirmed
notwithstanding its rejection by an impaired class of creditors or equity
holders and notwithstanding the fact that equity holders do not receive or
retain property on account of their equity interests under the plan. In
light of the foregoing and as stated in its October 8, 2005, press release
announcing the filing of its Chapter 11 reorganization cases, the company
considers the value of the common stock to be highly speculative and
cautions equity holders that the stock may ultimately be determined to have
no value. Accordingly, the company urges that appropriate caution be
exercised with respect to existing and future investments in Delphi's
common stock or other equity interests or any claims relating to
pre-petition liabilities.
SOURCE Delphi Corporation
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