New Gas Delivery System and End-pointing Capabilities Deliver Precise,
Flexible Circuit Edit for Increased Success Rates
HILLSBORO, Ore., June 19 /PRNewswire-FirstCall/ -- FEI (Nasdaq: FEIC)
has introduced a new member of its V600 focused ion beam (FIB) family. The
V600CE enables faster semiconductor design validation and performance
optimization on today's 65nm and below devices. Featuring an advanced ion
column technology, a versatile gas delivery system, and advanced
end-pointing control, the V600CE delivers enhanced circuit edit
capabilities.
Successful semiconductor companies rely on FIB-based circuit editing to
get new electronics products to market faster. Circuit editing is an
alternative to time-consuming mask and fabrication iterations, enabling
faster verification and prototyping of new designs. However, as
semiconductor geometries decrease to 45nm, and new materials are
introduced, successful FIB-based circuit edit becomes more challenging. The
V600CE is specifically designed to increase success rates, reducing
development costs and time-to-market.
"Modern integrated circuit devices introduce significant challenges to
circuit edit, including shrinking geometries, low-k dielectric materials,
dummy metallization and high circuit densities," said FEI Product Marketing
Manager Joseph Race. "The latest release in the V600 family demonstrates
FEI's commitment to deploying our core technologies on an extensible,
cost-effective circuit edit platform."
The V600CE improves etching planarity with its NanoChemix(TM) gas
delivery system. Innovative gas handling accommodates a wide range of
precursors for etching and deposition, and gas mixtures can be used to
improve electrical performance of insulator depositions. The unique
tri-nozzle delivery provides a symmetric, high-flux flow of agents. A
dedicated central nozzle delivers the precursor for metal depositions, and
dual opposing nozzles eliminate the shadowing that occurs in trenches
milled using single-nozzle systems.
The new system also includes a dynamic end-point solution that improves
operator control during critical applications. Live imaging of the active
pattern is displayed on the user interface, and both stage current readings
and secondary electron intensity for each active pattern are graphically
displayed. The combination of these graphical monitors with the live
milling image provides reliable end-pointing, resulting in higher edit
success rates.
FEI will feature the V600CE and its entire suite of time- and
cost-saving solutions for semiconductor manufacturers at SEMICON West, July
17-19, 2007 (Booth 2120, South Hall) at San Francisco's Moscone Center.
About FEI
FEI (Nasdaq: FEIC) is a global leader in providing innovative
instruments for nanoscale imaging, analysis and prototyping. FEI focuses on
delivering solutions that provide groundbreaking results and accelerate
research, development and manufacturing cycles for its customers in
Semiconductor and Data Storage, Academic and Industrial R&D, and Life
Sciences markets. With R&D centers in North America and Europe, and sales
and service operations in more than 50 countries around the world, FEI's
Tools for Nanotech(TM) are bringing the nanoscale within the grasp of
leading researchers and manufacturers. More information can be found online
at http://fei.com.
This news release contains forward-looking statements about a new
focused ion beam product and its capabilities. Factors that could affect
these forward-looking statements include but are not limited to delays in
the roll-out of the product, manufacturing or delivery delays and failure
of the product to perform as expected due to technical or other reasons.
Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings
with the U.S. Securities and Exchange Commission for additional information
on these factors and other factors that could cause actual results to
differ materially from the forward-looking statements. FEI assumes no duty
to update forward-looking statements.
SOURCE FEI
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Related links:
http://www.fei.com
CONTACT:
Dan Zenka, APR Global Public Relations of FEI
Company, +1-503-726-2695, dan.zenka@fei.com
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