Significant Multi-Million-Euro Order Win Furthers EVG's Reach in the 3D
Interconnect Space
ST. FLORIAN, Austria, July 8 /PRNewswire/ -- EV Group (EVG), a leading
supplier of wafer-bonding and lithography equipment for the advanced
semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging
nanotechnology markets, today announced it has received a major
multi-million-euro order from STMicroelectronics (NYSE: STM) for its 300-mm
bonding, alignment and photoresist processing tools. EVG's fully automated
tools are successfully installed at ST's 300-mm through-silicon-via (TSV)
pilot line in Crolles, France and used in the manufacture of CMOS imaging
sensors (CIS).
Industry experts have anticipated that the first products that feature
TSV technology are expected to hit the market in 2008 and will include
flash memory and image sensors, similar to what ST is developing with the
help of EVG's 300-mm solutions. The production of these devices by a
high-volume manufacturer (HVM) like ST marks a significant validation
milestone for this technology, which is still in its infancy. TSV adoption,
however, continues to rapidly gain traction, given its demonstrated
advantages that include higher performance, increased functionality, a
smaller footprint and lower power consumption. Recognizing the potential
early on, EVG has been a champion of bringing this technology to market
commercialization. Key to this effort, the company is a founding member of
the EMC-3D international consortium, which is chartered with developing the
3D market infrastructure by demonstrating a cost-effective, manufacturable,
stackable TSV interconnection technology.
According to Gareth Bignell, Program Manager, 300mm Equipment
Selection, STMicroelectronics, "ST is committed to accelerating the
manufacturing of 3D TSV-based devices into high volume. As such, we're
turning to trusted suppliers, like EVG, who can help us maintain our
competitive edge by minimizing manufacturing risks, while increasing the
speed of implementation and time to market. At the same time, we also
expect nothing less than superior and comprehensive service and support so
that our facility can continue to run at benchmark levels -- we expect that
EVG's solid and dependable support will continue to be a significant help
in this area."
"We are extremely pleased with the confidence ST, a long-standing
customer of our 200-mm solutions, now also has in our leading-edge 300-mm
portfolio, which is ideally suited for the burgeoning, but complex, 3D-TSV
market. Yet, we believe TSV technology holds tremendous potential and we
are poised and committed to being a key player in this space," said EVG's
Executive Technology Director, Paul Lindner. "This milestone order from ST
is testament to our ability to meet this chipmaker's rigorous demands for
reliable performance, uniformity and repeatability -- backed, of course, by
our unwavering 24/7 customer support," he added.
According to Lindner, a number of factors contributed to the company's
recent win with ST over the competition. Specifically, EVG's new NanoSpray
photoresist coating processing capabilities for steep topographies, along
with its IQ Aligner's proven ability to deliver precise and reliable
lithography backside alignment, are both unparalleled in the industry.
This, coupled with EVG's bonder, demonstrated high uniformity at 300mm --
and the company's comprehensive service and dedicated onsite support were
critical factors behind this most recent purchasing decision by ST. EVG
reports that the ST order also included its EVG150 Coater and EVG150
Developer, which in conjunction with its NanoSpray technology, consistently
deliver highly uniform coats with low material usage and improved
repeatability.
EV Group will be exhibiting at SEMICON West, July 15-17, 2008 at the
Moscone Center in San Francisco, Calif., USA. Editors and analysts
interested in learning more about the company and its complete product
range for 3D interconnect and TSV are invited to visit EVG's booth #5429
(North Hall).
About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its
flexible manufacturing model to develop reliable, high-quality,
low-cost-of-ownership systems that are easily integrated into customers'
fab lines. Key products include wafer bonding, lithography/nanoimprint
lithography (NIL) and metrology equipment, as well as photoresist coaters,
cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in
2006 to create and help drive implementation of a cost-effective
through-silicon via (TSV) process for major ICs and MEMS/sensors. Other
target semiconductor- related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and
operates via a global customer support network, with subsidiaries in Tempe,
AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to
manufacturing challenges and expedite device manufacturing in high volume.
More information is available at http://www.EVGroup.com.
SOURCE EV Group
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Related links:
http://www.EVGroup.com
CONTACT:
Thomas Fodermeyer, Director Marketing and
Communications of EV Group, + 43 7712 5311 0,
T.Fodermeyer@EVGroup.com; or Public Relations, Marie Labrie, Vice
President of MCA, Inc., +1-650-968-8900, ext. 119,
mlabrie@mcapr.com, for EV Group
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