New 2800 Series Delivers Unparalleled Inspection Capabilities - Giving
Chipmakers Ultimate Control Over Their Sub-65-nm Processes
SAN JOSE, Calif., July 11 /PRNewswire-FirstCall/ -- To help customers
brave the new defect and yield challenges emerging at the 65-nm and 45-nm
technology nodes, KLA-Tencor (Nasdaq: KLAC) today unveiled the 2800 Series
-- a breakthrough brightfield wafer inspection platform that enables the
widest capture of critical defects across all layers, without compromise.
Providing the industry's only ultra-broadband (DUV, UV and visible) wavelength
inspection at twice the throughput of previous-generation DUV brightfield
imaging tools, the 2800 Series sets new standards in the brightfield
inspection arena -- enabling chipmakers to meet the full range of inspection
requirements needed to accelerate the development and production ramp of their
future-generation ICs.
The innovation required to extend performance and conserve power in
future-generation ICs is creating a whole new wave of defect challenges. New
device structures and materials are creating a wide variety of new defect
types and noise sources, while the complexities of new lithography techniques
and reticle enhancement strategies are causing a dramatic rise in systematic
defects. The sheer magnitude of these defect challenges mandate extremely
sensitive and highly flexible inspection solutions capable of detecting the
broadest range of defect types in all layers and at multiple nodes. Since
different defect types, materials and device layers require different
inspection wavelengths for optimal defect detection, full-spectrum
ultra-broadband inspection across visible, UV and DUV wavelengths is now a
necessity.
KLA-Tencor's new 2800 Series was developed in response to this need, and
is the only platform capable of delivering flexible ultra-broadband wavelength
coverage to capture the full range of yield-critical defects. In contrast,
narrow-band or single-wavelength inspection techniques are severely limited in
their ability to capture a range of defect types across multiple device
layers, which results in critical defect gaps on multiple device layers.
"Given all the possible material and layer combinations that chipmakers
face at the sub-65-nm nodes, tunable-wavelength brightfield inspection should
play a critical role in uncovering a wider variety of yield-critical defects,"
stated Risto Puhakka, president of market research and consulting firm VLSI
Research Inc. "KLA-Tencor pioneered the automated brightfield inspection
market more than a decade ago with its broadband illumination approach, and
has continually refined the technology over the years -- amassing considerable
applications expertise which has helped leading chipmakers speed yield
learning and improve baseline yields. Their latest-generation ultra-broadband
brightfield platform, the 2800 Series, should be the next big thing in wafer
inspection to help chipmakers ensure optimal yields beyond 65 nm."
Breaking through the defect barriers with ultra-broadband inspection
Leveraging a third-generation DUV source with UV and visible light on a
single flexible platform, the 2800 Series provides selectable wavelengths
(from 260 to 450 nm) for maximum layer coverage. The 2800 also leverages
sensor technology first used in military satellite systems to enhance imaging.
KLA-Tencor adapted this technology for use in wafer inspection-creating
proprietary broadband solid-state time delay integration (TDI) sensors that
enable the 2800 Series to provide optimum materials contrast and noise
suppression. In addition to allowing chipmakers to zoom in and capture more
of the defects of interest, the combination of TDI sensors and ultra-broadband
illumination significantly reduces the damage risk and sensitivity trade-offs
associated with laser-based brightfield systems.
As a result, the 2800 Series is particularly well suited for inspecting
critical lithography and etch layers, where critical patterning defects are
most likely to occur. The platform also leverages custom-built large-field
catadioptric optics that provide high numerical aperture (NA) across all
illumination modes and sensitivity settings. Combined with high repeatability
(>90% matching) and real-time defect classification and sampling, the 2800
Series delivers both the high sensitivity and production-worthy performance
that chipmakers need to cost-effectively accelerate their yield learning and
fab ROI.
Best-of-breed inspection for all requirements
The 2800 Series is the second major inspection platform unveiled to date
in KLA-Tencor's complete suite of next-generation defect management systems
-- following on the heels of the Puma 9000, which was released last month.
Together, the 2800 Series and Puma 9000 platforms offer chipmakers the optimum
patterned wafer inspection mix to meet the production requirements of 65-nm
and smaller nodes. As a result, they are ideally suited for chipmakers
struggling to meet the demands of the consumer era, where higher-performing,
power-efficient chips are needed more quickly and at lower price points than
ever before.
"Just as the Puma 9000 platform set new standards in the darkfield
inspection arena, our 2800 Series is raising the bar in brightfield
inspection. With this new platform, customers get a full-spectrum inspection
capability covering the broadest range of critical defect types in a highly
configurable and extendible platform that can be used for both the development
and the ramp of multiple device generations," stated Lance Glasser, group vice
president of KLA-Tencor's Wafer Inspection Group.
The 2800 Series is already installed at multiple customer sites and will
be shipped in volume production later this year.
KLA-Tencor will showcase its latest yield management and process control
products, including the 2800 Series, at SEMICON West 2005, July 12-14, at the
Moscone Center in San Francisco, Calif. The company's booth is located in the
South Hall, #426.
About KLA-Tencor: KLA-Tencor is the world leader in yield management and
process control solutions for semiconductor manufacturing and related
industries. Headquartered in San Jose, Calif., the company has sales and
service offices around the world. An S&P 500 company, KLA-Tencor was named
one of the Best Managed Companies in America for 2005 by Forbes Magazine and
is the only company in the semiconductor industry to receive the accolade for
this year. KLA-Tencor is traded on the Nasdaq National Market under the
symbol KLAC. Additional information about the company is available on the
Internet at http://www.kla-tencor.com .
SOURCE KLA-Tencor
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Related links:
http://www.kla-tencor.com
CONTACT:
Uma Subramaniam, Director, Corporate
Communications, of KLA- Tencor, +1-408-875-5473, or
uma.subramaniam@kla-tencor.com; or David Moreno, Senior Account
Director, MCA, +1-650-968-8900, ext. 125, or dmoreno@mcapr.com,
for KLA-Tencor
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