Collaboration to Focus on Backside and Bevel-Edge Removal Solutions for ALD
Films
SCOTTS VALLEY, Calif. and VILLACH, Austria, July 11 /PRNewswire/ -- Aviza
Technology, Inc., a global supplier of production-proven thermal process and
atomic layer deposition (ALD) systems, and the SEZ Group (SWX: SEZN), the
market leader and premier innovator in single-wafer wet processing solutions
for the semiconductor industry, today announced they are joining forces to
solve key challenges surrounding ALD film removal for next-generation IC
manufacturing. Under a joint development agreement, both companies intend to
leverage their expertise to develop solutions for deposition and removal of
advanced films used in ALD applications, concentrating on the wafer backside
and bevel edge.
"With the ever-increasing complexity of semiconductor devices, backside
and bevel-edge film removal is playing an increasingly important role in the
IC manufacturing process," said Dr. Leo Archer, director of emerging
technologies worldwide, SEZ. "Our collaboration with Aviza will be mutually
rewarding, as we are both well positioned to address the intricacies of film
deposition and removal at the sub-90-nm node. By developing, characterizing
and refining processes for ALD film removal, we can provide our customers with
the solutions they need to address advanced manufacturing challenges."
Anneal conditions often dictate the degree of complexity associated with
backside and bevel-edge film-removal processes. As levels of crystallization
increase, annealed films require custom recipes and chemistries to ensure
proper removal, while maintaining the integrity of film properties and
decreasing cross contamination -- resulting in increased yields. Due to their
intricate composition, advanced films targeted for 45-nm high-K gate
dielectrics -- such as hafnium oxide (HfO), hafnium silicate (HfSiO) and
hafnium silicate oxynitride (HfSiO/N), as well as metals like ruthenium
(Ru) -- pose even greater challenges at these film-removal stages. The
challenge is to selectively remove contamination caused by these materials
from the backside and bevel edge of the wafer with a controlled wrap to the
front side in order to prevent cross-contamination and particle generation.
These can cause issues with device performance, film delamination, lithography
problems, and ultimately, device yield. Selectivity is important because it
is not always advantageous or possible to remove too much of the underlying
substrate material, be it silicon, oxide or nitride. Excessive etching can
remove a necessary diffusion barrier and can affect wafer flatness and
uniformity.
SEZ's Spin Processor technology offers advantages for this sort of
process, as it allows a patterned wafer to be processed face down on the
patented Bernoulli chuck. Moreover, the combined chuck, chemical dispense
system and chamber allow highly controlled wraparound to the front side of the
wafer to predefined distances.
"The development of materials and processes for ALD applications is key to
accelerating the ALD roadmap and driving the adoption of ALD," said Jon
Owyang, director of ALD product management at Aviza Technology. "Aviza is
continually evaluating and developing advanced films to complement
next-generation manufacturing processes. By entering into a collaboration
with SEZ, we intend to leverage our core areas of expertise to develop
advanced manufacturing and process solutions for our customers that meet
requirements for backside trace materials and backside particle levels."
Aviza and the SEZ Group will be exhibiting at SEMICON West 2005,
July 12-14, at the Moscone Convention Center in San Francisco. For more
information about each company and its products, please visit Aviza in the
South Hall at Booth #1616 or SEZ Group in the North Hall at Booth #5568.
About SEZ Group
The SEZ Group is the leading provider of single-wafer, wet-processing
solutions for the global semiconductor industry, with an installed base of
over 900 tools. The company maintains operations in Asia-Pacific, Europe,
Japan, and North America. SEZ Holding AG is traded on the SWX Swiss Exchange
under the symbol SEZN. Additional information about the company is available
on the Internet at http://www.sez.com.
About Aviza Technology, Inc.
Aviza Technology is a supplier of thermal processing, low-pressure
chemical vapor deposition and atomic layer deposition solutions to the global
semiconductor industry. The company maintains a worldwide installed base of
more than 2,500 tools. Aviza's headquarters, manufacturing and R&D facilities
are located in Scotts Valley, Calif. Additional sales and customer support
facilities are located in Germany, France, Scotland, Taiwan, China, Japan,
Singapore and Malaysia. Aviza has 500+ full-time employees and contractors
worldwide. Additional information can be found at http://www.avizatechnology.com.
SOURCE Aviza Technology, Inc.
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Related links:
http://www.sez.com
CONTACT:
Sherrie Gutierrez of Aviza Technology,
+1-831-439-6382, or sherrie.gutierrez@avizatechnology.com; or
Heinz Oyrer of SEZ Group, +43-4242-204-455, or
h.oyrer@at.sez.com; or Brandy L. Lee of MCA Public Relations,
+1-650-968-8900, or blee@mcapr.com, for Aviza Technology
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