New Product Offers Greater Flexibility and Better Accuracy for Faster Die
Handling Performance
NAPA, Calif. and SemiCon West, SAN FRANCISCO, July 12 /PRNewswire/ --
Royce Instruments, Inc., a leading assembly tool and bond testing machine
manufacturer for the photonic and semiconductor manufacturing industries,
today announced the introduction of a new fully automated handling system for
picking die from diced 300-mm wafers and transferring them to die carriers
(for example, waffle packs, GelPaks etc.). Called AutoPlacer, the new system
incorporates a number of design and engineering enhancements to Royce's
signature A45 system and offers customers a number of tangible benefits such
as reduced cycle times associated with die handling, improved die-to-wafer
traceability and reduced operator time for setup and system monitoring.
"Foremost, while maintaining cost-effective system pricing, we have
designed the AutoPlacer with more accuracy and speed, which results in faster
die-handling performance," commented Malcolm Cox, president and CEO of Royce
Instruments, Inc. "The throughput of the new system approaches 3000 units per
hour (dry cycle), which is relatively fast for automatic die handling in the
medium system price range, leading to a quicker return on investment for
customers." For assembly operations, faster throughput in die handling enables
cycle-time reductions. Compared to the Royce A45, the AutoPlacer delivers an
approximate 50 percent reduction in cycle time.
The AutoPlacer system determines die selection from a wafer-map, a
serpentine pattern without binning or the presence (or absence) of ink marks
on die. Compared to most die-handling systems on the market, the AutoPlacer
provides greater flexibility in die binning setup. Through software control
and drag-and-drop functionality, a specification bin can contain any of the 16
available die trays. "This capability is particularly advantageous when die
yield high to one bin code; assigning more trays to a bin that will receive a
larger number of die means that the die-handling operation will not require as
much operator intervention to unload trays as they fill up," noted Cox.
"Simply stated, we have put more flexible and intelligent use of bin trays on
the AutoPlacer."
The AutoPlacer also includes automatic generation of output maps for
interrupted runs. If a wafer is in process and is partially picked upon
receipt of another high priority job, the wafer can be removed and the high
priority job started. Later, the output map can be loaded with a full record
of the die left on the wafer to be picked.
The software capability of the AutoPlacer also enables the distribution of
bin codes on a wafer to correlate to tray output distribution. "This feature
maintains die traceability for better process control," said Cox. The output
file contains data for each placed die; including the original location on the
wafer and the pocket number of the actual placement. "When the die sort is
complete, engineers have a stored record of where the die in a pocket of a
waffle pack came from on the wafer. When defects during subsequent inspections
or device failures occur, the die can be traced back to a bin code and a
precise location on the wafer, which helps to achieve faster process
correction and yield improvements," Cox continued.
The design of the AutoPlacer has been enhanced with a flexible platform
that facilitates fast changeovers when switching product die types, including
the die eject head, the pickup tip, the wafer holder, alignment components and
recipe setting. "This is a cost savings to production operations," Cox said.
"One die handling system can be used more universally with less down time for
system setup changes. With our ability to quickly change between wafer and die
types, we have eliminated the tendency for the pick-and-place process to be a
bottleneck in assembly production."
With the AutoPlacer, Royce has brought its years of experience in handling
small and fragile die into play. The AutoPlacer includes a range of die-edge,
curved, pyramid and other die 'grippers' that can be matched to many different
die-handling requirements. For example, with very small die that are difficult
to pick up, the AutoPlacer has a tungsten carbide tip with a vacuum hole less
than 5 mils in diameter. This, along with its stage motion control, helps to
pick-and-place die down to 8 mils square into small pockets in waffle packs
repeatedly."
The AutoPlacer includes a hinged full enclosure safety cover and a side
mounted monitor and keyboard that allows an operator to make changes to
recipes and initiate runs while seated or standing.
The Royce AutoPlacer will be operating in the Royce Instruments, Inc.,
booth (No. 7011, West Hall, Level 1) at SEMICON West, the Moscone Center, San
Francisco from July 11-15, 2005.
About Royce Instruments, Inc.
Royce Instruments, Inc. is based in Napa, California. The company designs
and manufactures assembly and bond testing systems used in the photonics and
semiconductor manufacturing industries. Its products include equipment for
laser-diode manufacturing, wire and die bond testing, semiconductor die
pick-and-place, and hybrid epoxy die bonding.
Royce Instruments' customers include leading laser and photonics
manufacturers, major semiconductor companies, assembly subcontractors,
computer manufactures, aerospace companies, and most of the world's largest
automobile, heart pacemaker, and medical electronics device manufacturers.
More information is available on the Royce Instruments website
http://www.royceinstruments.com/ .
Editor Notes:
Additional materials, such as a Q&A sheet, product data sheet and product
photography of the AutoPlacer is available electronically from Mark Button at
Positio PR -- Please contact mark@positio.com or call (001)408-453-2400
CONTACT: Lisa Gerbracht of Royce Instruments, Inc., +1-707-255-9078, or
lgerbracht@royceinstruments.com; or Mark Button of Positio Public Relations,
+1-408-453-2400, or mark@positio.com, for Royce Instruments, Inc.
SOURCE Royce Instruments, Inc.
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Related links:
http://www.royceinstruments.com
CONTACT:
Lisa Gerbracht of Royce Instruments, Inc.,
+1-707-255-9078, or lgerbracht@royceinstruments.com; or Mark
Button of Positio Public Relations, +1-408-453-2400, or
mark@positio.com, for Royce Instruments, Inc.
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