Multiple VeraFlex tools enabling development and inline production of
advanced memory devices with additional systems shipping into major memory
manufacturers over next quarter
SUNNYVALE, Calif., July 12 /PRNewswire/ -- ReVera Incorporated, a
leader in materials metrology solutions, today announced that it has
significantly increased its penetration of the memory market. Multiple
VeraFlex(TM) metrology systems are currently installed at major memory
manufacturers, with additional shipments scheduled over the next quarter.
ReVera has also rolled out a new suite of critical memory applications to
support its growing customer base. As memory manufacturers transition to
new materials and more complex processes, ReVera's XPS-based VeraFlex
systems are increasingly seen as an enabling technology in the development
and the production of their most advanced memory devices.
"From the outset our strategy has been to first serve gate dielectric
metrology needs, while at the same time developing our applications breadth
and continually improving our metrology technology to enable us to address
the requirements of additional markets," commented ReVera CEO Dave Ring.
"We have successfully accomplished the first goal, with a significant
number of tools deployed worldwide for gate applications. Now we're
extending the reach of our technology to support the advanced processes
used in the manufacture of flash and DRAM storage cells. Our success in the
memory market demonstrates the value of our system in enabling the
development of new, critical memory processes and their rapid transition
into high-volume manufacturing."
Addressing Memory Manufacturing Requirements
The aggressive development path for memory devices, seen as exceeding
Moore's Law of generational device shrinks, is driving the need for memory
manufacturers to integrate more and more advanced new materials and
processes. In addition, the requirements of these new processes are often
outside of the process ranges of traditional metrology equipment. ReVera's
VeraFlex system fills these gaps in both development and high-volume
production applications by providing direct measurement of critical
parameters with a high degree of sensitivity -- all in one wafer pass. The
detailed, comprehensive results provided by VeraFlex enable users to
rapidly identify excursions and take direct action to immediately address
them.
The end result is fast, effective development of new materials and
processes, and a smooth transition to production, both critical to meeting
the tight market windows for advanced memory devices. ReVera has
demonstrated its ability to meet these requirements, as exemplified by a
leading Taiwanese memory device manufacturer having already adopted the
company's technology as its primary inline approach for monitoring key
memory capacitor layers in high-volume manufacturing.
New Suite of Memory Applications
To support the flash and DRAM markets, ReVera has developed a suite of
new applications specifically targeted at emerging technology challenges
where tighter compositional control is critical for yield improvement.
These customer-proven applications address a broad range of high-K,
metallization and implant processes, including:
-- Boron plasma doping for poly - Developed to provide critical dopant
concentration control of an extremely high dose surface implant,
outside the capabilities of traditional metrology.
-- High-K capacitor - Allows thickness and composition control of
multi-component and laminate high-K material with a single metrology
technology whereas traditional methods requiring multiple measurement
tools.
-- Engineered flash dielectrics - Provides critical thickness,
composition, and depth profile information for highly engineered
dielectric layers such as tunnel oxide and charge trap layers for
SONOS and TANOS-type flash devices.
-- Advanced metallization for memory cell electrode - Developed to
control composition and contamination of thin metal films for work
function tuning and yield control.
In addition, the architecture of ReVera's materials metrology systems
enables rapid development and deployment of new applications to address
emerging process and material challenges.
To learn more about ReVera's materials metrology solutions for logic
and memory applications, please visit ReVera at SEMICON West in San
Francisco, Calif., July 17-20, 2007. ReVera will be exhibiting in the North
Hall at Booth T6 as a part of the SEMI 2007 Technology Innovation Showcase
(TIS), and is the only metrology company selected this year as a TIS
winner.
About ReVera's Technology
With a large installed base of tools in high-end device manufacturing
fabs, ReVera's XPS (x-ray photoelectron spectroscopy) technology is
recognized as the preferred technique to control the thickness,
composition, depth distribution and chemical properties of critical films.
While standard optical metrology tools rely on numerous estimates and
assumptions to generate thickness and composition data, ReVera's advanced
x-ray based technique directly measures critical parameters that must be
controlled in production and provide comprehensive results that enable
direct action. ReVera's approach dramatically simplifies the process
control task and assures customers that their devices can be manufactured
within the defined performance specifications.
About ReVera
ReVera Incorporated is a leading provider of materials metrology
solutions for advanced semiconductor processing. Its products allow device
manufacturers to measure, monitor and control critical materials
properties, enabling them to rapidly integrate and manage the new materials
required for 65 nm, 45 nm and beyond. ReVera systems are proven in
production in a broad range of applications, and are backed by a global
network of applications, field service, sales and logistics personnel.
ReVera was established in 2004 as a management-led spin-out from Physical
Electronics and its wholly owned subsidiary, Charles Evans and Associates.
Visit http://www.revera.com for more information.
SOURCE ReVera Incorporated
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Related links:
http://www.revera.com
CONTACT:
John A. Samuels, Ph.D., +1-408-530-3600,
jsamuels@revera.com, of ReVera Incorporated
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