Solutions Including Ultra-Thin SOI and Ultra-Thin BOX Support the Full
 Range of Applications and Device Architectures for the sub-45 nm Roadmap.

    BERNIN, France, July 15 /PRNewswire-FirstCall/ -- Soitec (Euronext
Paris), the world's leading supplier of silicon-on insulator (SOI) wafers
and other engineered substrates used in the microelectronics industry, has
announced today a new generation of advanced substrates that support all
the applications and architectures on the industry's sub-45 nm roadmap. New
solutions such as ultra-thin top silicon and ultra-thin Buried OXide (BOX)
give device architects and designers complete flexibility in their choice
of substrates for partially depleted (PD) and fully-depleted (FD) devices,
including multi-gate transistor architectures (FinFET, Trigate).

    The new generation of substrates is built on the highly successful
300mm Unibond(TM) XUT+ wafers, which are currently shipping to leading
customers for the PD 45-nm logic market, and which are also under
qualification or sampling with other customers in a variety of
system-on-chip applications.

    "To make strategic choices for 32 nm and beyond, Soitec customers now
have a full range of options at their disposal," notes Paul Boudre,
Soitec's COO. "Device architects can leverage substrate design in their
solutions for scaling, low power, and greatly reduced threshold voltage
variability, thus ensuring SRAM scalability, and in particular stability at
low operation voltages and significantly improved soft error rate. This is
a major advantage for IC design today. In addition, CMOS process
simplifications, and advanced SOI memory solutions-like single transistor
body cell or ZRAM- result in a lower cost-of-ownership for SOI ICs."

    This new generation of substrates fabricated using the company's
patented Smart Cut(TM) process is designed to meet the most advanced
requirements in terms of defectivity, flatness and SOI thickness control of
up to plus or minus10 Angstroms (A). The top silicon layer of these wafers
is available in thicknesses ranging from just 20 nm up to 110 nm, while the
BOX can be as thin as 10 nm. Options are also available like High
Resistivity substrate and strained SOI.

    Visit Soitec in San Francisco, at Semicon West, North Hall, booth
#5428.

    About the Soitec Group:

    The Soitec Group is the world's leading innovator and provider of the
engineered substrate solutions that serve as the foundation for today's
most advanced microelectronic products. The group leverages its proprietary
Smart Cut(TM) technology to engineer new substrate solutions, such as
silicon-on-insulator (SOI) wafers, which became the first high-volume
application for this proprietary technology. Since then, SOI has emerged as
the material platform of the future, enabling the production of higher
performing, faster chips that consume less power.

    Today, Soitec produces more than 80 percent of the world's SOI wafers.
Headquartered in Bernin, France, with two high-volume fabs on-site, Soitec
has offices throughout the United States, Japan and Taiwan, and a new
production site in the process of customers' qualification in Singapore.

    Two other divisions, Picogiga International (Les Ulis) and Tracit
Technologies (Bernin), complete the Soitec Group. Picogiga focuses on
delivering advanced substrates solutions, including III-Vs epiwafers and
gallium nitride (GaN)-based wafers, to the compound material world for the
manufacture of high-frequency electronics and other optoelectronic devices.
Tracit, on the other hand, focuses on thin-film layer transfer technologies
used to manufacture advanced substrates for power ICs and microsystems, as
well as generic circuit transfer technology for applications such as image
sensors and 3D-integration. Shares of the Soitec Group are listed on
Euronext Paris. For more information, visit http://www.soitec.com.

    Soitec, Smart Cut and UNIBOND are trademarks of S.O.I.TEC Silicon On
Insulator Technologies.

    Press Contact: (also available during Semicon West for interviews at
the show)



    Camille Darnaud-Dufour
    Tel (France): +33(0)6-79-49-51-43
    E-mail: camille.darnaud-dufour@soitec.com

Link to this page: