Industry Luminaries from Leading Semiconductor Companies Join Soitec's R&D
Team
SAN FRANCISCO, July 17 /PRNewswire/ -- SEMICON WEST -- Soitec (Euronext
Paris), the world's leading supplier of silicon-on-insulator (SOI) wafers
and other engineered substrates, today announced that Dr. Bich-Yen Nguyen
and Dr. Mohamad Shaheen have joined the company as Fellows. Dr. Nguyen
previously led the Crolles Alliance advanced transistor development
activities at Freescale Semiconductor, while Dr. Shaheen headed the
advanced substrates research group within the component research
organization at Intel. Both new hires will focus on the development of new
applications and markets for Soitec's core technologies, and will also
support the newly created Marketing, Sales and Customer Group.
"Material innovations at the substrate level are playing an
increasingly critical role in allowing manufacturers to realize enhanced
device characteristics in terms of speed, power consumption, form factor
and other key attributes," said Carlos Mazure, chief technical officer and
executive vice president at Soitec. "The addition of Dr. Bich-Yen Nguyen
and Dr. Mohamad Shaheen highlights the commitment from Soitec to support
our manufacturing customers, while continuing to deliver the engineered
substrate solutions that will enable next-generation production of advanced
electronic devices. Both of these experienced technologists bring a
reputation for innovative thinking at the design level to an already
accomplished Soitec R&D team and our Marketing, Sales and Customer Group."
Dr. Nguyen joins Soitec after a twenty-seven-year career at Freescale
Semiconductor. In this role, she leveraged her technical expertise in IC
processes and materials, CMOS and BiCMOS integration and trouble shooting
for process, device and yield-related issues. Her experience in advanced
MOS IC technology development, transfer and manufacturing spans numerous
technology nodes, ranging from 4 micrometers to 22 nm and beyond.
During her tenure at Freescale, Dr. Nguyen received many illustrious
awards and honors, including the Distinguished Innovation Award in 1991;
the Motorola Sector Technology High-Impact Technology Award in 1996; the
Motorola Master of Innovation Award in 2003; the National Women of Color in
Technology Lifetime Achievement Award in 2004; and was also appointed a
Motorola Dan Noble Fellow in 2001. In addition to these accomplishments,
she has invented and co-invented more than 55 issued patents, 11 pending
patents and 8 defensive publications, while authoring and co-authoring more
than 70 technical papers in various journals and proceedings.
Dr. Shaheen joins Soitec after a distinguished fifteen-year career at
Intel, where he held a number of technical management positions. In his
most recent role, Dr. Shaheen was group leader of the advanced substrates
technology group within the component research organization focusing on
advanced materials and structures for novel devices, such as depleted
substrate transistor (DST) and tri-gate. Other positions included project
manager of novel memory in the novel device and nanotechnology group;
front- end manager of the research and path finding fab; and senior process
engineer in thin films, logic technology development, where he was
responsible for gate oxide stability, salicide development and copper
electrofill. Dr. Shaheen holds more than 75 patents and patent filings in
the area of advanced device materials and structures, and has received
several awards from Intel for outstanding contributions, including an
excellence award from the Technology and Manufacturing Group in 2005.
About the Soitec Group:
The Soitec Group is the world's leading innovator and provider of the
engineered substrate solutions that serve as the foundation for today's
most advanced microelectronic products. The group leverages its proprietary
Smart Cut(TM) technology to engineer new substrate solutions, such as
silicon-on- insulator (SOI) wafers, which became the first high-volume
application for this proprietary technology. Since then, SOI has emerged as
the material platform of the future, enabling the production of higher
performing, faster chips that consume less power.
Today, Soitec produces more than 80 percent of the world's SOI wafers.
Headquartered in Bernin, France, with two high-volume fabs on-site, Soitec
has offices throughout the United States, Japan and Taiwan, along with a
new manufacturing site under construction in Singapore.
Two other divisions, Picogiga International (Les Ulis) and Tracit
Technologies (Bernin), complete the Soitec Group. Picogiga focuses on
delivering advanced substrates solutions, including III-Vs epiwafers and
gallium nitride (GaN)-based wafers, to the compound material world for the
manufacture of high-frequency electronics and other optoelectronic devices.
Tracit, on the other hand, focuses on thin-film layer transfer technologies
used to manufacture advanced substrates for power ICs and microsystems, as
well as generic circuit transfer technology for applications such as image
sensors and 3D-integration. Both shares and convertible bonds for the
Soitec Group are listed on Euronext Paris. For more information, visit
http://www.soitec.com.
Soitec, Smart Cut and UNIBOND are trademarks of S.O.I.TEC Silicon On
Insulator Technologies
SOURCE The Soitec Group
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Related links:
http://www.soitec.com
CONTACT:
Camille Darnaud-Dufour, Vice President,
Communications, of Soitec, Mobile (France), +33-6-79-49-51-43,
camille.darnaud-dufour@soitec.com; or Kelly Picasso, Sr. Account
Associate of MCA, +1-650-968-8900, ext. 127, kpicasso@mcapr.com,
for Soitec
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