Single-Package 3-D SiP Technology Enables High-Speed and High-Resolution
for Image Processing in Mobile Consumer Devices
TOKYO and SANTA CLARA, Calif., Aug. 1 /PRNewswire/ -- NEC Corporation,
(Nasdaq: NIPNY) NEC Electronics Corporation, and its subsidiary in North
America, NEC Electronics America, Inc., today unveiled a new
system-in-package (SiP) technology capable of stacking logic and
gigabit-class memory in a single package to enable high-speed,
high-definition image processing in mobile devices. The new SiP technology,
SMAFTI(TM) (SMArt connection with Feed-Through Interposer), features a
three-dimensional (3-D) chip connection whose approximately 60-micron gap
and 50-micron-pitch microbump between the logic and memory devices can
support transmissions up to 100 gigabits per second (Gbps). Designers who
use SMAFTI technology in cellular phones and other portable equipment that
have stringent size and power constraints can achieve resolutions
comparable to those achieved in high-definition television.
"The strong demand for digital video television, digital video gaming
and other digital video capabilities in portable consumer devices is
driving the need for high-speed image processing that realizes
crystal-clear resolutions," said Takaaki Kuwata, general manager, Advanced
Device Development Division, NEC Electronics Corporation. "System-on-chip
(SOC) technologies present a disadvantage in terms of development cost and
memory capacity, while conventional SiP products have larger package sizes
due to thicker interposers, and have limitations in signal transfer speed,
wire-bonding interconnections, and side-by-side chip placement. The new
SMAFTI technology successfully resolves these issues and enables engineers
to effectively design and manufacture high-performance systems for mobile
electronic devices."
Enabling Technologies
NEC Electronics and NEC developed the SMAFTI technology by leveraging
three key enabling technologies: a 50-micron-pitch microbump
interconnection technology, a 15-micron-thick feed-through interposer (FTI)
based on superconnect technology, and a multichip assembly process.
The microbump interconnection technology makes it possible to realize
low power dissipation, a small form factor, and high-speed interchip
communication at more than 100 Gbps, ten times faster than conventional
technologies. The small 50-micron-pitch interconnection size is the result
of a silicon-to- silicon attachment process that effectively reduces the
size of conventional pitch bumps and enables designers to accommodate four
times the number of bumps in the same area. This process produces
high-speed data transfers and is more reliable than the conventional
silicon and organic substrate attachment process.
Superconnect technology is used in chip fabrication and has a copper
signal trace 15 microns wide and a polyimide layer 7 microns thick -- half
that of a conventional substrate. The 15-microns-thick FTI, which is based
on superconnect technology, makes it possible to convert a chip's wiring
pitch to 50 microns and to fan out the pitch connection of an outer ball
grid array to 500 microns. As a result, the routing of signals from a logic
chip with a 50-micron pitch and memory connection points to universal
substrate terminals can be simplified.
The multichip assembly process is an enhancement of existing
wafer-based manufacturing processes that are typically used for SOC
manufacturing. Memory chips are first mounted onto silicon wafers using
wiring based on superconnect technology. Then the chips and wiring layer
are molded by resin and the silicon wafer is removed. The BGA attachment
process follows.
Availability
Products featuring SMAFTI technology are expected to be available
during the first quarter of 2007 in a variety of lead-free package sizes.
Availability is subject to change.
About NEC
NEC Corporation is one of the world's leading providers of Internet,
broadband network and enterprise business solutions dedicated to meeting
the specialized needs of its diverse and global base of customers. NEC
delivers tailored solutions in the key fields of computer, networking and
electron devices, by integrating its technical strengths in IT and
Networks, and by providing advanced semiconductor solutions through NEC
Electronics Corporation. The NEC Group employs more than 150,000 people
worldwide and had net sales of approximately 4,825 billion yen (approx.
$41.2 billion) in the fiscal year ended March 2006. For additional
information, please visit the NEC home page at: http://www.nec.com .
About NEC Electronics
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor
products encompassing advanced technology solutions for the high-end
computing and broadband networking markets, system solutions for the mobile
handset, PC peripherals, automotive and digital consumer markets, and
platform solutions for a wide range of customer applications. NEC
Electronics Corporation has 25 subsidiaries worldwide including NEC
Electronics America, Inc. (http://www.am.necel.com ) and NEC Electronics (Europe)
GmbH (http://www.eu.necel.com ). For additional information about NEC Electronics
worldwide, visit http://www.necel.com .
NOTE: SMAFTI is a trademark of NEC Electronics in Japan, Germany, Korea
and Taiwan. NEC Electronics is either a registered trademark or trademark
of NEC Electronics Corporation in the United States and/or other countries.
All other registered trademarks or trademarks are property of their
respective owners.
SOURCE NEC Electronics Corporation
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Related links:
http://www.nec.com
http://www.am.necel.com http://www.eu.necel.com
http://www.necel.com
CONTACT:
Denise Garibaldi of NEC Electronics America,
Inc., +1-408-588-6620, or denise.garibaldi@am.necel.com; or Lisa
Neitzel of Porter Novelli, +1-408-369-4623, or
lisa.neitzel@porternovelli.com, for NEC Electronics Corporation;
or in Japan, Sophie Yamamoto of NEC Electronics Corporation,
+81-44-435-1676, or sophie.yamamoto@necel.com; or Diane Foley of
NEC Corporation, +81-3-3798-6511, or d-foley@ax.jp.nec.com
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