Broadcom(R) Chipset Shipping in New Samsung Wi-Fi(R) Phone

		Broadcom Corporation is a global leader in semiconductors for wired and wireless communications. Our products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. Broadcom provides the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(r). www.broadcom.com. (PRNewsFoto/BROADCOM) IRVINE, CA UNITED STATES

Broadcom Wi-Fi Phone Chipset Enables Feature-Rich Phones With High-Quality Voice, Longer Battery Life and the Latest in Security and Quality of Service BOSTON, Sept. 12 /PRNewswire-FirstCall/ -- (Fall 2006 VON Conference & Expo) Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that the Broadcom(R) Wi-Fi(R) phone chipset has been selected by Samsung for its new line of consumer and small business Wi-Fi phones. Broadcom's Wi-Fi phone chipset enables consumer phone makers to develop IP phones with high voice quality, extended range, longer battery life and support for the latest security and quality of service (QoS) standards. (Logo: http://www.newscom.com/cgi-bin/prnh/20060609/BROADCOMLOGO ) "Samsung's dominant position as a global phone supplier and established relationships with service providers make them a strategic partner for Broadcom," said Patrick Sullivan, Vice President and General Manager of Broadcom's VoIP business unit. "They are well-positioned to bring a new class of consumer products, such as the Wi-Fi phone, into the mainstream market." "Broadcom's Wi-Fi phone chipset offered Samsung a compelling solution for our next-generation families of consumer and small business IP phone products," said W.S. Cho, Vice President, Internet Infra R&D Team at Samsung. "Broadcom provided us with a solid roadmap that will enable us to incorporate advanced functionality for features such as video and multimedia into our phone designs." Broadcom's Wi-Fi phone chipset is featured initially in two Samsung Wi-Fi phone models: the SMT-W5100 for small businesses and the SMT-W6100, a multimedia phone for consumers. The SMT-W5100 is currently available for the enterprise market worldwide. The SMT-W6100, targeting residential customers, is currently being sold in North America and will soon be offered globally. Broadcom's Wi-Fi Phone Chipset Broadcom's Wi-Fi phone chipset consists of the Broadcom mobile VoIP processor and AirForce One(TM) 54g(R) single-chip WLAN solution. Broadcom is currently shipping the BCM1161 mobile VoIP processor, which features low-power, advance multimedia and telephony functions including polyphonic ring-tone support, a 2 Megapixel digital camera and voice/video record/playback. Telephony features include 3-way conferencing and speaker phone support, and high-fidelity voice capabilities through the use of Broadcom's BroadVoice(R) technology. The BCM4318 WLAN solution integrates a high-performance 2.4 GHz radio, IEEE 802.11a/b/g baseband processor, and media access controller (MAC). It supports Broadcom's SecureEasySetup(TM) technology for push-button wireless set up and security configuration, as well as BroadRange(TM) for up to 50% greater range, which enables wireless VoIP phones to maintain connectivity at greater distances from the wireless router. The device also incorporates support for the latest in security and QoS standards including WPA/WPA2, WMM and WMM Power Save. Broadcom's Wi-Fi phone chipset is available in production today. A complete reference design, which helps accelerate a customers' time to market, is also available. The reference design includes Broadcom's VoIP xChange(TM) software suite, the Session Initiation Protocol (SIP) call signaling stack, the WLAN OneDriver(TM) and Linux(R) OS-based board support package including all of the necessary drivers and software development tools. About Broadcom Broadcom Corporation is a global leader in semiconductors for wired and wireless communications. Our products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. Broadcom provides the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R). Broadcom, one of the world's largest fabless semiconductor companies with annual revenue of more than $2.5 billion, is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-450-8700 or at http://www.broadcom.com. Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995: All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement. Important factors that may cause such a difference for Broadcom in connection with Wi-Fi phone products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; uncertainties as a result of the company's previously-disclosed ongoing review of its practices in respect of options/equity grants to employees, and the publicized more general review of option grant practices throughout the technology and other industries by public regulatory bodies, and potential changes in accounting and other practices resulting therefrom; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for Wi-Fi phone applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors. Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason. Broadcom(R), the pulse logo, Connecting everything(R), the Connecting everything logo, BroadVoice(R), AirForce One(TM), BroadRange(TM), OneDriver(TM), SecureEasySetup(TM) and VoIP xChange(TM) are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Wi-Fi(R) is a trademark of the Wi-Fi Alliance. Linux(R) is a trademark of Linus Torvalds. Any other trademarks or trade names mentioned are the property of their respective owners. Broadcom Trade Press Contact Broadcom Technical Contact Gennis Lafayette Monika Gupta Public Relations Manager Senior Manager, Residential VoIP 408-543-3413 949-926-7111 gennisl@broadcom.com monika@broadcom.com Broadcom Investor Relations Contact T. Peter Andrew Vice President, Investor Relations 949-926-5663 andrewtp@broadcom.com