Demonstrates Industry's Continued Confidence in Single Wafer Wet-Clean
Solutions for New Manufacturing Requirements Associated with Shrinking Device
Geometries Down to 90 nm
TAIPEI, Taiwan, Sept. 15 /PRNewswire/ -- The SEZ Group (SWX Swiss
Exchange: SEZN), the market leader and premier innovator in single-wafer
cleaning technology for the semiconductor industry, today announced it has
secured a multimillion dollar order (totaling approximately 7.5 million Euro)
from a major Taiwanese DRAM manufacturer for several of its 323 flexible
multi-task, single-wafer Spin-Processors. The tools, which will be installed
at the manufacturer's Taiwan fab in December, will be used for backside
cleaning and the removal of polymer residue of back-end-of-line (BEOL)
structures on 300-mm wafers with geometries down to 90 nm.
Traditionally, chipmakers have leveraged organic chemicals in the cleaning
process-but these chemicals come at a high premium to a cost-conscious
industry where capital spending resources are severely limited. As such, the
industry is evaluating inorganic cleaning agents, such as dilute acid/hydrogen
peroxide (DSP), as an effective replacement due to its significant cost
advantages-both from a supply and a waste-disposal standpoint. However,
leveraging inorganic agents such as DSP on wet benches is not as effective or
reliable as that of a single-wafer tool in removing the residue from metal
lines and contact/via structures, which becomes increasingly challenging as
design nodes continue to shrink. SEZ's single-wafer Spin-Processing
technology for polymer removal with DSP tackles this issue head on-delivering
superior performance at a low cost of ownership (CoO).
"While SEZ has dominated single-wafer wet processing in the foundry
market, we are now witnessing growing interest among memory makers to convert
their current installed base of wet benches to single-wafer tools for polymer
removal and backside cleaning, as evidenced by this order," said Kurt
Lackenbucher, chief marketing officer. "The stringent processing requirements
associated with shrinking design rules and new materials is fueling demand for
single-wafer technology due to the benefits it affords, including higher
productivity and uniformity, lower CoO and reduced risk of cross contamination
during critical cleans. This benchmark performance, coupled with the system's
ability to support DSP as an effective, lower-cost alternative to organic
agents without jeopardizing performance, were critical factors behind this
win."
323 Features and Benefits
SEZ's flexible 323 Spin-Processing system is designed to meet next-
generation requirements for high throughput cleaning and film removal
applications for 300-mm wafer processing. A robot on a linear tracking system
transports 300-mm wafers from four cassettes to two identical process chambers
that can apply up to three chemicals each. The chemical cabinet for each
chemical supplies both chambers, while all other support systems are
integrated in the main unit. Object-oriented software architecture
(Windows(R) NT platform) with a SEMATECH-compliant graphical user interface
and touch screen simplify equipment operation.
For more information about SEZ's Spin-Processing technology and product
portfolio, please visit booth #426 at the Taipei World Trade Center during
SEMICON Taiwan 2003 from September 15-17.
About SEZ Group
The SEZ Group is the leading provider of single-wafer, wet-clean
processing solutions for the global semiconductor industry, with an installed
base of over 750 tools. The company maintains operations in Europe, Asia-
Pacific, Japan and North America. Since 1996, registered shares of SEZ
Holding Ltd. are traded on the SWX Swiss Exchange under the symbol SEZN.
Additional information about the company is available on the Internet at
http://www.sez.com
SOURCE SEZ Group
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Related links:
http://www.sez.com
CONTACT:
Heinz Oyrer of SEZ Group, +43-4242-204-455,
or fax, +43-4242-204-469, or h.oyrer@at.sez.com; or Brandy
Heartburg of MCA, +1-650-968-8900, or fax, +1-650-968-8990, or
bheartburg@mcapr.com, for SEZ Group
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