SEMICON Taiwan, TAIPEI, Taiwan, Sept. 15 /PRNewswire-FirstCall/ -- Soitec,
the leading manufacturer of silicon-on-insulator (SOI) wafers for use in
semiconductor manufacturing, today reaffirmed its commitment to support and
speed Taiwanese foundries' move from R&D to production of devices at the 90-nm
node using SOI wafers. Key to this effort, Soitec -- along with its partner
SOISIC -- the world's first company to focus solely on SOI IP and design
technology, are committed to developing the infrastructures and the design
kits that will allow them to quickly and efficiently respond to their fabless
customers' demands for SOI as the substrate material for their next-generation
devices.
"Soitec is witnessing increasing interest in SOI technology among
Taiwanese foundries. As these foundries begin their move toward the
production of their next-generation products, they are realizing that SOI can
help address the increasingly stringent process performance requirements
associated with manufacturing these advanced devices. Along with SOISIC, we
are committed to this rapidly growing region and are armed with the
technology, expertise, capacity and localized support needed to rapidly
respond to these foundries as they ramp up production on SOI wafers," said
Michael Wolf, Soitec's senior vice president of marketing and sales.
With greater than 80 percent market share, Soitec is the leading provider
of advanced SOI thin-film substrates for integrated circuit (IC)
manufacturing, and is the only SOI company capable of delivering, in high
volumes, a full range of thick- and thin-film SOI wafers in both 200-mm and
300-mm diameters. SOI material delivers key uniformity and performance
advantages enabling chips to perform approximately 30 percent more
efficiently, while consuming two to three times less power -- critical
qualities for next-generation devices. Soitec's objective is to establish its
Smart Cut(TM) proprietary technology as the worldwide standard among
chipmakers and foundries alike for meeting the increasing performance
requirements of new applications.
Soitec is also leveraging its Smart Cut technology to develop new families
of engineered wafers and customized wafer solutions beyond SOI. Most
recently, Soitec and partner ASM International announced that they have
achieved a major milestone in their strained silicon-on-insulator (sSOI)
partnership program. Marking an industry first, the joint program has
produced samples of first-generation strained silicon wafers for the 65-nm
technology node. Strained SOI combines two high-performance technological
solutions: strained silicon and ultra-thin SOI.
Validating customers' growing confidence and satisfaction with Soitec as
the leading SOI provider, the company recently announced that it has
received a World Class Supplier Spotlight Award from Advanced Micro Devices,
Inc. (NYSE: AMD) in recognition of its overall SOI support and commitment to
AMD. Soitec was awarded the honor due to its flexibility and superior
customer service provided in a rapidly changing business environment, which
enabled AMD to achieve its manufacturing objectives quickly and effectively.
Soitec provides AMD with volume quantities of advanced thin-film UNIBOND(TM)
SOI substrate solutions for the production of the AMD Opteron(TM) and upcoming
AMD Athlon(TM) 64 processor products.
Editors interested in learning more about Soitec's SOI technology are
invited to attend a press briefing given by Soitec's Senior Vice President of
Marketing and Sales, Michael Wolf. The briefing will be held in the pressroom
of the Taipei World Trade Center on Tuesday, September 16 at 3:30 p.m. in
conjunction with SEMICON Taiwan. Interested editors can also drop by the
company's booth #1280 at SEMICON Taiwan from September 15-17.
About Soitec: Soitec is the world's leading manufacturer and supplier of
SOI wafers, with greater than 80-percent market share. Headquartered in
Bernin, France, Soitec provides a broad range of advanced thin-film substrates
for IC manufacturing, including bonded SOI (UNIBOND(TM)) and silicon-on-quartz
(SOQ) wafers-all of which are manufactured using Soitec's proprietary Smart
Cut(TM) process. Soitec is traded on the French "Nouveau Marche" of Euronext
Paris (Sicovam code 7206). Additional information is available on the
Internet at http://www.soitec.com
About SOISIC: Headquartered in Grenoble, France, SOISIC (Silicon on
Insulator Systems and Integrated Circuits) is the world's first company to
focus solely on SOI semiconductor intellectual property (SIP) market and SOI
design technology. As a spin-off from LETI, the company has over 15 years of
expertise in SOI technology. SOISIC offers products (Xpert Kit, digital
libraries, ASIC design, analog/RF design, SRAM design) based on its advanced
knowledge of emerging processes to foundries and independent device
manufacturers and ultimately aims to become a significant fabless
semiconductor company. Additional information is available on the Internet at
http://www.soisic.com
NOTE: Smart Cut and UNIBOND are trademarks of S.O.I.TEC Silicon On
Insulator Technologies. AMD, AMD Opteron and AMD Athlon, and combinations
thereof, are trademarks of Advanced Micro Devices, Inc.
SOURCE Soitec
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Related links:
http://www.soitec.com
CONTACT:
Camille Darnaud-Dufour, Director of
Communications of Soitec, +1-650-251-9066 (U.S.), or mobile
(France), +33-06-79-49-51-43, or
camille.darnaud-dufour@soitec.com; or Brandy Heartburg of MCA,
+1-650-968-8900, or fax, +1-650-968-8990, or
bheartburg@mcapr.com, for Soitect
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