Breakthrough Offers Significant Benefits in Cost-effectiveness and Device
Performance
BOSTON, Sept. 15 /PRNewswire-FirstCall/ -- EMBEDDED SYSTEMS CONFERENCE --
Motorola (NYSE: MOT) introduces the first commercially available high
frequency RF plastic package capable of operating a junction temperature of up
to 200 degree Celsius. The latest addition to Motorola's RF power plastic
packaging portfolio continues a string of industry firsts, which began with
the introduction of the first RF power plastic package in 1996. Now, with the
qualification of the MRF9045M, Motorola has set a new industry standard for
power plastic packaging capable of operating at 200 degree C device junction
temperature. This operating temperature, once only used for high-reliability
packages in industrial/military applications or metal-ceramic packages, has
now been achieved in plastic packaging.
Immediate advantages of this packaging breakthrough include:
-- Higher power capability in the same footprint
-- Alternative, cost-effective solutions to metal-ceramic packaging
-- Surface-mount technology (SMT) solutions for high power RF devices
-- Lower system thermal management costs
-- Easier manufacturing for OEMs by enabling automated assembly of RF
power amplifiers
-- Increased thermal margin over standard plastic packaging
Historically, the wireless infrastructure market for high power RF
applications has relied on metal-ceramic package technology. For years
metal-ceramic provided a robust solution for high-performance,
extreme-condition applications. However, rapid growth of the global wireless
market has created the need for higher volume, cost-effective solutions that
metal-ceramic packaging cannot offer.
"We listened to our customers' requests for higher performance packaging
that offers the flexibility to reduce overall system costs in the areas of
manufacturing and thermal management," said Lynelle McKay, vice president and
general manager of Motorola's RF & DSP Infrastructure Division. "Along with
the manufacturing cost benefits, this breakthrough maintains the RF
performance our customers have come to expect."
By extending the operating temperature of the RF plastic package to
200 degree C, Motorola is enabling designers to use the higher performance
capabilities of RF plastic devices without increasing thermal management
costs. It also gives customers a choice of solutions to match their
manufacturing requirements. Additionally, this innovation makes possible the
use of Motorola components in compact locations such as masthead amplifiers
where additional cooling may be minimal or non-existent.
This technology will be applied to a portfolio of high power, high
frequency products that will also be designed to meet a minimum of JEDEC MSL 3
260 degree C reflow capability and industry requirements for lead-free
terminals.
About Motorola, Inc.'s Semiconductor Products Sector
As the world's #1 producer of embedded processors, Motorola's
Semiconductor Products Sector creates DigitalDNA(TM) system-on-chip solutions
for a connected world. Our strong focus on wireless communications and
networking enables customers to develop smarter, simpler, safer and
synchronized products for the person, work team, home and automobile.
Motorola's worldwide semiconductor sales were $5.0 billion (USD) in 2002. For
more information please visit http://www.motorola.com/semiconductors.
About Motorola, Inc.
Motorola, Inc. (NYSE: MOT) is a global leader in providing integrated
communications and embedded electronic solutions. Sales in 2002 were
$27.3 billion. Motorola is a global corporate citizen dedicated to ethical
business practices and pioneering important technologies that make things
smarter and life better, honored traditions that began when the company was
founded 75 years ago this year. For more information, please visit
http://www.motorola.com.
MOTOROLA and the Stylized M Logo are registered in the US Patent &
Trademark Office. All other product or service names are the property of
their respective owners.
SOURCE Motorola, Inc.
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Related links:
http://www.motorola.com
http://www.motorola.com/semiconductors
http://www.esconline.com/boston
Photo Notes:
NewsCom:
http://www.newscom.com/cgi-bin/prnh/20020307/MOTLOGO
http://www.newscom.com/cgi-bin/prnh/20020415/MOTNOTAGLOGO
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CONTACT:
North America -- Nancy Castro,
+1-480-413-6528, or Mobile, +1-480-250-8703,
nancy.castro@motorola.com; or Europe -- Regina Cirmonova,
+41-22-799-1258, regina.cirmonova@motorola.com; or Latin America
-- Ruth Ruiz, +1-480-814-4897, ruth.ruiz@motorola.com; or
Asia/Pacific -- Gloria Shiu, +852-2666-8237,
gloria.shiu@motorola.com, all of Motorola, Inc.; or Japan --
Koichi Yoshimura of Motorola Japan Ltd., +81-3-3280-8672,
koichi.yoshimura@motorola.com; or North America -- Kathy
Truesdell, +1-512-996-5117, or Mobile, +1-512-633-8620,
truesdel@onr.com, for Motorola
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