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Merrimac Announces Third Quarter 2004 Financial Results and Conference Call Information

    WEST CALDWELL, N.J., Nov. 15 /PRNewswire-FirstCall/ -- Merrimac
Industries, Inc. (Amex: MRM), a leader in the design and manufacture of RF
Microwave components, assemblies and micro-multifunction modules (MMFM(R)),
today announced plans to release its third quarter 2004 financial results
before the market opens on Tuesday, November 16, 2004.
    Investors are invited to participate in the financial results conference
call on Tuesday November 16, 2004 at 4:15 p.m. (Eastern) by dialing
1-800-319-9003 (for International callers: 1-719-457-2619) ten minutes prior
to the scheduled start time, and reference the Merrimac Industries third
quarter 2004 conference call.  For those unable to participate, a replay will
be available for seven days by dialing 1-888-203-1112, or 1-719-457-0820 for
international callers, passcode number 756500.
    This conference call will also be broadcast live over the Internet by
logging on to the web at this address:

      http://phx.corporate-ir.net/playerlink.zhtml?c=73209&s=wm&e=968228

    If you are unable to participate during the live webcast, a link to the
archived webcast will be listed on the Merrimac Industries, Inc. website
http://www.merrimacind.com .

    About Merrimac
    Celebrating its 50th anniversary, Merrimac Industries, Inc. is a leader in
the design and manufacture of Multi-Mix PICO(TM) RF Microwave components,
assemblies and micro-multifunction modules (MMFM), serving the wireless
telecommunications industry worldwide with enabling technologies for space,
defense and commercial applications. Merrimac is focused on providing Total
Integrated Packaging Solutions(R) with Multi-Mix(R) Microtechnology, a leading
edge competency providing value to our customers through miniaturization and
integration. The Multi-Mix(R) process for microwave, multilayer integrated
MMFM circuitry is a patented method developed by Merrimac Industries based on
fluoropolymer composite substrates. The fusion bonding of multilayer
structures provides a homogeneous dielectric medium for superior electrical
performance at microwave frequencies. The bonded layers may incorporate
embedded semiconductor devices, MMICs, etched resistors, passive circuit
elements and plated-through via holes to form a three-dimensional subsystem
enclosure that requires no further packaging. Merrimac Industries facilities
are registered under ISO 9000, an internationally developed set of quality
criteria for manufacturing operations.
    Merrimac Industries, Inc. and its subsidiary Filtran Microcircuits Inc.,
are located in West Caldwell, NJ, San Jose, Costa Rica and Ottawa, Ontario,
Canada, and have approximately 240 co-workers dedicated to the design and
manufacture of signal processing components, gold plating of high-frequency
microstrip, bonded stripline and thick metal-backed Teflon (PTFE) micro-
circuitry and subsystems providing Total Integrated Packaging Solutions(R) for
wireless applications. Merrimac (MRM) is listed on the American Stock
Exchange. Multi-Mix(R), Multi-Mix PICO(TM), MMFM(R) and Total Integrated
Packaging Solutions(R) are trademarks of Merrimac Industries, Inc.  For more
information about Merrimac Industries, Inc. and Filtran Microcircuits Inc.,
please visit http://www.merrimacind.com and http://www.filtranmicro.com .

     Contact:  Mason N. Carter, Chairman & CEO
               Merrimac Industries, Inc.
               mnc@merrimacind.com
               973-575-1300, ext. 1202


SOURCE Merrimac Industries, Inc.




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Related links:
  • http://www.merrimacind.com
  • http://phx.corporate-ir.net
  • http://www.filtranmicro.com
    Company News On-Call:
  • http://www.prnewswire.com/comp/567525.html
    CONTACT:
    Mason N. Carter, Chairman & CEO of Merrimac
    Industries, Inc., +1-973-575-1300, ext. 1202, or
    mnc@merrimacind.com