Laminate Substrates, Valued at $6.2 Billion, Will Lead Sector Growth
SAN JOSE, Calif., Nov. 27 /PRNewswire/ -- The market for semiconductor
packaging materials, including thermal interface materials, is expected to
reach $15.5 billion in 2007 and grow to $20.2 billion by 2011, according to
a new study by SEMI and TechSearch International. Laminate substrates
remain the largest segment of the market, worth an estimated $6.2 billion
globally in 2007, and on a unit basis are projected to grow at a compound
annual growth rate of over 12 percent over the next five years.
The report, titled "Global Semiconductor Packaging Materials Outlook-
2007/2008 Edition", covers laminate substrates, flex circuit/tape
substrates, leadframes, bonding wire, mold compounds, underfill materials,
liquid encapsulants, die attach materials, solder balls, wafer level
package dielectrics and thermal interface materials.
Semiconductor Packaging Estimate of 2007
Materials Segment Global Market
$M
Laminate Substrates $6,196.0
Flex Circuit/Tape Substrates $262.5
Leadframes $3,118.0
Bonding Wire $3,178.3
Mold Compounds $1,371.0
Underfill Materials $138.0
Liquid Encapsulants $117.0
Die Attach Materials $562.2
Solder Balls $265.0
Wafer Level Package Dielectrics $9.8
Thermal Interface Materials $303.0
The findings in the report are based on more than 125 in-depth
interviews conducted with packaging subcontractors, semiconductor
manufacturers and materials suppliers. It includes previously unpublished
data on revenue, unit shipments and market shares for each packaging
material segment; a five-year forecast of revenue and units (2007-2011),
average selling price data and trends; and an analysis of regional market
trends.
The report also identifies important technology and business trends
affecting the packaging materials market, as well as opportunities for
suppliers. Some of the key opportunities include:
-- Reduced cost structures for standard laminate products
-- Thin core substrate materials with suitable properties to reduce
warpage effects and improve handling.
-- Alloy development to support on-going migration to smaller diameter
gold bonding wire.
-- Die attach materials and processes compatible with ultrathin wafer
technologies
-- Resin materials that do not degrade moisture sensitivity levels and
are compatible with low-k dielectrics and lead-free processing.
-- Underfill solutions for fine bump pitch and large die
The report is available for purchase from SEMI for $4,000 (SEMI
members), and $5,000 (non-members). A company-wide site license is also
available.
About SEMI:
SEMI is the global industry association serving the manufacturing
supply chains for the microelectronic, display and photovoltaic industries.
SEMI member companies are the engine of the future, enabling smarter,
faster and more economical products that improve our lives. Since 1971,
SEMI has been committed to helping members grow more profitably, create new
markets and meet common industry challenges. SEMI maintains offices in
Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai,
Singapore, Tokyo, and Washington, D.C. For more information, visit
http://www.semi.org.
About TechSearch International:
Founded in 1987, TechSearch International (Austin, Texas) is a
technology licensing and consulting company specializing in accurate,
relevant and timely information on advanced packaging technology and market
developments. For more information, visit TechSearch International Inc. at
http://www.techsearchinc.com
SOURCE SEMI
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Related links:
http://www.semi.org
http://www.techsearchinc.com
CONTACT:
Dan Tracy, +1-408-943-7987, dtracy@semi.org,
or Scott Smith, +1-408-943-7957, ssmith@semi.org, both of SEMI
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