Manufacturing fast, efficient 8051 core with patented vertical connection and
wafer stacking technology produces processor with triple the typical speed
SHINAGAWA, Tokyo, IP Japan, May 18 /PRNewswire/ -- Customer Tezzaron(R)
Semiconductor has implemented a core from intellectual property (IP) provider
CAST, Inc., using patented wafer stacking technology to produce the first
three-dimensional integrated circuit (3D IC) processor.
Tezzaron's 3D IC processor uses the vertical connections and precise
stacking of their FaStack(R) process to place 128 Kbytes of SRAM memory above
the 8051-type processor and bind the two layers into a single device. Using a
160 nm technology, the resulting 3D IC runs up to ten times faster and
requires only about 1/10th the power of a typical 8051. The core, CAST's
R80515, uses a reduced instruction set and other features that make it an
effective and efficient embedded processor or controller.
"We wanted to demonstrate our technology with a workhorse processor that's
still used in thousands of products and devices around the world," said Robert
Patti, Tezzaron's chief technology officer. "CAST proved to be a great
partner-easy to work with and providing excellent support-and implementing
their core was painless and straightforward."
Tezzaron has delivered the 3D processor to several potential customers for
evaluation. More information on both the processor and the FaStack(R)
technology is available on the company's web site at http://www.tezzaron.com.
The 3D processor will also be running in a demonstration in CAST's booth at
the upcoming Design Automation Conference (http://www.dac.com).
About Tezzaron and the FaStack(R) Technology
The FaStack(R) process integrates multiple wafer layers and uses through-
silicon vertical connections to produce remarkably dense and fast 3D chips. A
special wafer thinning process solves the thermal build-up problem of previous
stacking technologies, and the tight integration yields an IC that is
significantly denser than similar-seeming System-in-Package (SiP) components.
With their high speed, tiny size, superior memory access, and low power
requirements, FaStack(R) ICs are suitable for a wide variety of applications,
including embedded controllers, sensor arrays, and other high-end products and
components.
Tezzaron is a privately held corporation, with offices in Illinois and
Singapore. For sales information, call +1 (630) 505-0404 or email
sales@tezzaron.com. For press information, contact Robert Patti by phone at +1
(630) 505-0404 x134 or by email at rpatti@tezzaron.com.
About CAST, Inc.
CAST provides about 100 popular and standards-based IP cores for ASICs and
FPGAs. Privately owned and operating since 1993 with a focus on making IP
practical and affordable, CAST has established a reputation for high-quality
IP products, simple licensing, and responsive technical support. The company
is headquartered near New York City, partners with IP developers around the
world, and works with select sales consultants and distributors throughout
Europe and Asia.
Contacts:
Hal Barbour, CAST, Inc., 201/391-8300 ext. 111, hal@cast-inc.com
Paul Lindemann, Montage Marketing, 603/490-4985, paul@montmark.com
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SOURCE CAST, Inc.
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CONTACT:
Hal Barbour of CAST, Inc., +1-201-391-8300
ext. 111, hal@cast- inc.com; or Paul Lindemann of Montage
Marketing, +1-603-490-4985, paul@montmark.com
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