Backside Illumination Technology Improves Image Quality, Enables Design
Shrinks Down to 0.9 Micron Pixels
SUNNYVALE, Calif., May 27 /PRNewswire-FirstCall/ -- OmniVision
Technologies, Inc. (Nasdaq: OVTI), the world's largest supplier of CMOS
image sensors, today launched its OmniBSITM architecture, a novel sensor
design that adopts a radically different approach to traditional CMOS image
sensor technology. Using backside illumination (BSI), OmniBSI enables
OmniVision to continue offering improved image quality while extending its
pixel roadmap down to 0.9 micron pixels, which is the key to continued
miniaturization of digital imaging technology. OmniVision developed OmniBSI
architecture with the support of its long-time foundry and process
technology partner, Taiwan Semiconductor Manufacturing Corporation (TSMC).
BSI methodology involves turning the CameraChip(TM) sensor upside down
so that it collects light through what was previously the backside of the
sensor, the silicon substrate. This approach differs from conventional
front side illumination (FSI) image sensors, where the amount of light
reaching the photo-sensitive area is limited, in part, by the multiple
metal and dielectric layers required to enable the sensor to convert
photons into electrons. The FSI approach can block or deflect light from
reaching the pixel, ultimately reducing the fill factor and causing
additional problems, such as cross talk, between pixels. BSI reverses the
arrangement of layers so that the metal and dielectric layers reside below
the sensor array, providing the most direct path for light to travel into
the pixel. This novel approach optimizes light absorption, enabling
OmniVision to build a 1.4 micron BSI pixel that surpasses all the
performance metrics of 1.4 micron, and even most 1.75 micron, FSI pixels.
OmniBSI architecture delivers a number of performance improvements over
FSI, including increased sensitivity per unit area, improved quantum
efficiency and reduced cross talk and photo response non-uniformity, which
all lead to significant improvements in image quality. Since light directly
strikes the silicon, the fill factor of the image sensor is significantly
improved so as to deliver best-in-class low-light sensitivity. A much
higher chief ray angle enables shorter lens heights which in turn allows
for thinner camera modules, which are ideal for use in the next generation
of ultra-thin mobile phones. Finally, BSI technology affords a much larger
aperture size, which allows for lower f stops facilitating the development
of better performing camera modules with superior camera performance.
"Moving FSI pixel architectures down to 1.4 micron and below, under
current design rules, poses some real challenges because metal lines and
transistors are driving the aperture of the pixel close to the wavelength
of light, its physical limit," said Howard Rhodes, Vice President of
Process Engineering at OmniVision. "To overcome this with traditional FSI
pixel technology would require a migration to 65 nm copper process
technologies, which would significantly increase the complexity and cost of
manufacturing. Because it allows for more than three layers of metal, BSI
achieves significant manufacturing benefits without moving to smaller
process nodes. This means routing can be simplified and die sizes can be
smaller than in FSI sensors, without the need to move to smaller process
nodes with all their associated complexities and additional costs."
"Although backside illumination concepts have been studied for over 20
years, up until now nobody has been able to successfully develop the
process for commercial, high volume CMOS sensor manufacturing," said Dr.
Ken Chen, Senior Director, Mainstream Technology Marketing, TSMC.
"Combining OmniVision's imaging expertise with TSMC's experience in process
development, we have delivered a truly advanced technology that defines the
future of digital imaging."
"BSI allows OmniVision to further extend its competitive edge in
digital imaging technology, while continuing the use of our
production-proven, 0.11 micron process technology. This provides major cost
and performance advantages for OmniVision and, ultimately, our customers,"
concluded Rhodes.
OmniVision is currently demonstrating an 8 MegaPixel, OmniBSI
CameraChip sensor, and expects to start sampling first products before the
end of June.
About OmniVision(R)
OmniVision Technologies designs and markets high-performance
semiconductor image sensors. Its CamerChip(TM) products using OmniPixel(R),
OmniPixel2(TM), OmniPixel3(TM), OmniPixel3-HS(TM) and OmniBSI(TM)
technologies are highly integrated single-chip CMOS image sensors for
mass-market consumer and commercial applications such as mobile phones,
digital still cameras, security and surveillance systems, interactive video
games, laptops and PCs and automotive and medical imaging systems.
Additional information is available at http://www.ovt.com.
Safe-Harbor Language
Certain statements in this press release, including statements
regarding the performance achievements and capabilities of BSI, the
advantages that BSI provides to OmniVision and its customers, the effect of
BSI on future digital imaging and the timing of the release of BSI
products, are forward-looking statements that are subject to risks and
uncertainties. These risks and uncertainties, which could cause the
forward-looking statements and OmniVision's results to differ materially,
include, without limitation: potential errors, design flaws or other
problems with BSI; risks associated with developing future architecture and
products incorporating BSI; the rapid changes in technical requirements for
camera phone products; competitive risks; as well as other risks detailed
from time to time in OmniVision's Securities and Exchange Commission
filings and reports, including, but not limited to, OmniVision's most
recent annual report filed on Form 10-K. OmniVision expressly disclaims any
obligation to update information contained in any forward-looking statement
whether as a result of new information, future events or otherwise.
OmniVision(R), the OmniVision logo and OmniPixel(R) are registered
trademarks of OmniVision Technologies, Inc. CameraChip(TM), OmniPixel2(TM),
OmniPixel3(TM), OmniPixel3-HS(TM) and OmniBSI(TM) are trademarks of
OmniVision Technologies, Inc.
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SOURCE OmniVision Technologies, Inc.
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Related links:
http://www.ovt.com
CONTACT:
Scott Foster, +1-408-542-3077,
sfoster@ovt.com, or investors, Steven Horwitz, +1-408-542-3263,
both of OmniVision Technologies, Inc.; or media, Martijn Pierik
of Impress Public Relations, Inc., +1-602-366-5599,
martijn@impress-pr.com, for OmniVision Technologies, Inc.
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