MIGDAL HA'EMEK, Israel, December 11 /PRNewswire-FirstCall/ -- Camtek
Ltd. (Nasdaq: CAMT, TASE: CAMT) announced today the introduction of Pegasus
200S - a new model in Camtek's Pegasus product line of automated optical
inspection (AOI) systems for finished high-density interconnect substrates
(HDI-S).
The Pegasus 200s has completed a series of field tests at customers'
sites. Camtek has installed so far around ten systems of the new model, the
majority of which have already been qualified for production.
"We have been witnessing a growing interest in replacing the manual
quality assurance operation by an automatic yet intelligent inspection
equipment," commented Yankee Yavor, VP of PCB and HDI-S inspection products
at Camtek. "We believe that the new Pegasus model delivers the throughput
and intelligent logic to become a standard tool in the fast-growing HDI
substrate industry."
About Pegasus 200S
Pegasus 200S is an advanced Automated Optical Inspection (AOI) system
dedicated to the inspection of finished High-Density Interconnect
Substrates (HDI-S) such as PBGA & CSP strips, and other gold plated
applications.
The Pegasus 200S is equipped with a new high-sensitivity CCD camera and
with dedicated illumination systems, especially designed and optimized for
the inspection of plated metallic surfaces (gold / silver / tin / OTC) and
for solder mask materials. Its enhanced Image Acquisition system, along
with its robust image processing engine, enable the detection of fine
defects and micro-cracks in demanding applications.
Thanks to its technological advantages, the Pegasus 200S raises the
standards of final inspection in the HDI-S industry by enabling the
detection of critical defects on both the interconnect pads and solder mask
areas, providing high throughput and yield improvement of the final
product.
About Camtek Ltd.
With headquarters in Migdal Ha'Emek Israel, Camtek Ltd., designs,
develops, manufactures, and markets automatic optical inspection systems
and related products. Camtek's automatic inspection systems are used to
enhance both production processes and yield for manufacturers in the
printed circuit board industry, the high density interconnect substrate
industry and the semiconductor manufacturing and packaging industry. This
press release is available at http://www.camtek.co.il.
This press release may contain projections or other forward-looking
statements regarding future events or the future performance of the
Company. These statements are only predictions and may change as time
passes. We do not assume any obligation to update that information. Actual
events or results may differ materially from those projected, including as
a result of changing industry and market trends, reduced demand for our
products, the timely development of our new products and their adoption by
the market, increased competition in the industry, price reductions as well
as due to risks identified in the documents filed by the Company with the
SEC.
Contact Information
Camtek:
Ronit Dulberg, CFO
Tel: +972-4-604-8308
Fax: +972-4-604-8300
Mobile: +972-54-9050776
ronitd@camtek.co.il
IR/PR Israel
Financial Communication
Noam Yellin
Tel: +972-3-6954333
Fax: +972-544-246720
IR International
Ehud Helft / Kenny Green
GK International
Tel: (US) +1-866-704-6710
kenny@gk-biz.com
ehud@gk-biz.com
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SOURCE Camtek Ltd
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CONTACT:
Contact information: Camtek: Ronit Dulberg,
CFO, Tel: +972-4-604-8308, Fax: +972-4-604-8300, Mobile:
+972-54-9050776, ronitd@camtek.co.il. IR/PR Israel, Financial
Communication, Noam Yellin, Tel: +972-3-6954333, Fax:
+972-544-246720. IR International, Ehud Helft / Kenny Green, GK
International, Tel: (US) +1-866-704-6710, kenny@gk-biz.com,
ehud@gk-biz.com
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